TE0841-03-41I31-A

TE0841-03-41I31-A

  • Description:MOD SOM USCALE 2GB DDR4
  • Series:-

SKU:a13e2527d4f6 Category: Brand:

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Product Detailed Parameters

  • Description:MOD SOM USCALE 2GB DDR4
  • Series:-
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:-
  • Core Processor:-
  • Co-Processor:-
  • Speed:-
  • Flash Size:-
  • RAM Size:-
  • Connector Type:-
  • Size / Dimension:-
  • Operating Temperature:-

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TE0841-03-41I31-A

Overview

The TE0841-03-41I31-A is a System-on-Module manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Zynq 7020 SoC featuring dual ARM Cortex-A9 processors and programmable logic fabric. The module includes 1 GB of DDR3L memory and 64 MB of flash storage. Operating within a temperature range of -40°C to +85°C, it supports interfaces including Ethernet, I2C, JTAG, QSPI, and USB 2.0. The physical dimensions are 52 mm x 76 mm.

Feature Summary

  • Integrates AMD Zynq 7020 SoC with dual-core ARM Cortex-A9 processing system
  • Includes mounted heat spreader for thermal management in industrial environments
  • Supports multiple high-speed communication interfaces including three Ethernet ports
  • Compact form factor suitable for space-constrained embedded designs

Applications

  • Industrial automation and control systems requiring robust FPGA capabilities
  • Medical imaging devices needing real-time signal processing
  • Aerospace and defense avionics operating in extreme temperatures
  • Test and measurement equipment requiring flexible I/O configurations

Procurement Notes

Verify component availability through authorized distributors as supply status may vary. Confirm RoHS compliance details directly with the manufacturer or official datasheets before integration. Ensure that the specific ordering suffix matches the required hardware configuration. Check for any end-of-life notifications or discontinuance alerts associated with this module variant prior to final procurement decisions.

Selection Notes

Select this module when dual-core ARM processing combined with FPGA flexibility is required. The integrated heat spreader makes it suitable for passive cooling scenarios. Verify interface requirements against the available pins on the SOM carrier board. Consider the operating temperature range if deploying in harsh industrial environments without active thermal regulation.

Part Context

This module belongs to Trenz Electronic's portfolio of modular computing solutions based on AMD Xilinx technology. It serves as a building block for custom embedded systems, allowing engineers to focus on application-specific logic rather than baseboard design. The company provides ECAD models and library loaders to facilitate integration into standard electronic design automation workflows.

Replacement Considerations

No public confirmed substitutes are listed in the provided documentation. Engineers should evaluate other Trenz Electronic SOMs based on processor family compatibility and pin-out similarities. Cross-referencing with AMD Zynq 7000 series modules from other vendors requires careful verification of electrical characteristics and mechanical footprints.

TE0841-03-41I31-ATE0841-03-41I31-A

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