TE0865-02-DGE93MA

TE0865-02-DGE93MA

  • Description:MPSOC MODULE WITH ZYNQ ULTRASCAL
  • Series:Zynq

SKU:41bb7496ea24 Category: Brand:

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Product Detailed Parameters

  • Description:MPSOC MODULE WITH ZYNQ ULTRASCAL
  • Series:Zynq
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:FPGA
  • Core Processor:Zynq™ UltraScale+™ XCZU17EG-2FFVC1760E
  • Co-Processor:-
  • Speed:-
  • Flash Size:256MB
  • RAM Size:8GB
  • Connector Type:B2B
  • Size / Dimension:3.937" L x 2.953" W (100.00mm x 75.00mm)
  • Operating Temperature:0°C ~ 85°C

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TE0865-02-DGE93MA

Overview

The TE0865-02-DGE93MA is a System-on-Module (SOM) manufactured by Trenz Electronic, integrating an AMD Xilinx Zynq UltraScale+ MPSoC. This specific variant utilizes the ZU17EG-2E processor core. The module provides substantial memory resources, featuring 8 GB of DDR4 SDRAM with Error Correction Code (ECC) support for the Processing System and an additional 8 GB of DDR4 memory dedicated to the Programmable Logic. It is designed for high-performance embedded applications requiring significant data processing capabilities.

Feature Summary

  • Integrates AMD Xilinx Zynq UltraScale+ MPSoC ZU17EG-2E
  • Provides 8 GB DDR4 ECC memory for the Processing System
  • Includes 8 GB DDR4 memory for the Programmable Logic
  • Supports rugged board-to-board stacking connectors for high-speed I/O

Applications

  • Industrial automation and control systems
  • High-throughput data acquisition platforms
  • Advanced medical imaging devices
  • Telecommunications infrastructure equipment

Procurement Notes

Verify current availability status as this component may be subject to limited supply or discontinuation notices. Confirm that the specific suffix DGE93MA matches the required memory configuration and processor grade. Check for any Product Change Notifications (PCN) related to pinout or electrical characteristics before finalizing procurement plans.

Selection Notes

Select this module when high-capacity memory is required for both PS and PL domains. Ensure the host carrier board supports the specific connector type and power delivery requirements of the ZU17EG-2E. Consider thermal management solutions, such as heat spreaders, if operating in enclosed environments or under heavy computational loads.

Part Context

This part belongs to the TE0865 family of modular systems from Trenz Electronic. These modules are designed to simplify the integration of complex Xilinx SoCs into custom hardware designs. The family typically offers various memory configurations and processor options to suit different performance and cost constraints within the embedded computing sector.

TE0865-02-DGE93MATE0865-02-DGE93MA

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