TEC0850-03-15EG1EA

TEC0850-03-15EG1EA

  • Description:IC MODULE
  • Series:TEC0850

SKU:d85fd45ceffd Category: Brand:

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Product Detailed Parameters

  • Description:IC MODULE
  • Series:TEC0850
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MCU, FPGA
  • Core Processor:Zynq UltraScale+ XCZU15EG-1FFVB1156E
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:8GB
  • Connector Type:CompactPCI Serial Backplane
  • Size / Dimension:-
  • Operating Temperature:-

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TEC0850-03-15EG1EA

Overview

The TEC0850-03-15EG1EA is a CompactPCI serial carrier board manufactured by Trenz Electronic GmbH. It serves as a base platform for integrating System-on-Module (SoM) products within the CompactPCI serial form factor. Designed for industrial and high-end applications, this carrier facilitates the deployment of embedded digital signal processing systems based on FPGA and CPU architectures. The board supports high-speed data acquisition and precise measurement tasks, leveraging Trenz Electronic's engineering expertise in developing robust solutions for harsh environments.

Feature Summary

  • Supports CompactPCI serial module integration
  • Enables high-speed data acquisition capabilities
  • Facilitates embedded digital signal processing
  • Designed for industrial environment reliability

Applications

  • Industrial process control systems
  • High-accuracy measurement instrumentation
  • Embedded digital signal processing units
  • CompactPCI serial based hardware platforms

Procurement Notes

Verify the specific revision level and connector compatibility with your chosen SoM before procurement. Confirm that the carrier board meets all environmental specifications required for your target industrial application. Ensure that the firmware and software support packages are available for the integrated modules. Cross-reference the mechanical dimensions with your chassis requirements to guarantee proper fitment and cooling performance.

Selection Notes

Select this carrier when a CompactPCI serial form factor is mandated for your system architecture. It is suitable for designs requiring robust FPGA or CPU-based processing in industrial settings. Consider this option if you need a proven platform for rapid prototyping of high-speed data acquisition systems. Evaluate thermal management needs relative to the power dissipation of the installed SoM.

Part Context

Trenz Electronic GmbH specializes in development services and turnkey designs for the electronics industry since 1992. The company focuses on embedded systems using FPGA and CPU architectures, particularly for automotive and industrial sectors. The TEC0850 series represents their commitment to providing standardized carrier solutions that simplify the integration of their proprietary System-on-Modules into complex electronic systems.

Replacement Considerations

No public confirmed substitutes are identified for this specific carrier board model. As it is part of a specialized ecosystem designed for Trenz Electronic modules, alternative carriers may require significant redesign of mechanical and electrical interfaces. Verify compatibility with existing SoMs if considering alternative vendors.

TEC0850-03-15EG1EATEC0850-03-15EG1EA

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