TEM0005-02-010I

Overview

The TEM0005-02-010I is a System-on-Module manufactured by Trenz Electronic GmbH, featuring the Microsemi SmartFusion2 SoC FPGA. This module integrates an ARM Cortex-M3 processor with Flash-based FPGA fabric, providing a complete embedded solution in a compact form factor. It supports mixed-signal applications and secure boot functionalities, designed for industrial and commercial environments requiring low power consumption and high reliability.

Feature Summary

• Integrates Microsemi SmartFusion2 SoC FPGA with ARM Cortex-M3 core
• Supports secure boot and encrypted storage capabilities
• Compact System-on-Module design for space-constrained applications

Applications

• Industrial automation control systems
• Medical device embedded controllers
• Secure IoT edge nodes
• Automotive instrumentation modules

Procurement Notes

Verify component availability through authorized distributors as lead times may vary. Confirm RoHS compliance and specific package variants prior to ordering. Ensure compatibility with required carrier boards or baseboards for proper integration into final designs.

Selection Notes

Select this module when a combined MCU and FPGA solution is required within a single package. Consider thermal management requirements based on target operating conditions. Verify interface pinouts against the specific carrier board design to ensure signal integrity and connectivity.

Part Context

Trenz Electronic specializes in FPGA and SoC modules for embedded systems. The TEM0005 series utilizes Microsemi technology, offering a balance of programmability and processing power. These modules are part of a broader ecosystem including evaluation kits and carrier boards for rapid prototyping.

Replacement Considerations

Check for direct substitutes from Trenz Electronic using updated Microsemi components. Evaluate alternative SoC-FPGA modules from other manufacturers if supply constraints exist. Ensure functional equivalence regarding pinout and software compatibility before switching.