TEM0007-01-CAA11-A

TEM0007-01-CAA11-A

$227.80
  • Description:MICROCHIP POLARFIRE SOC FPGA 25T
  • Series:PolarFire®

SKU:76229b3eb189 Category: Brand:

  
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Product Detailed Parameters

  • Description:MICROCHIP POLARFIRE SOC FPGA 25T
  • Series:PolarFire®
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:FPGA
  • Core Processor:-
  • Co-Processor:-
  • Speed:-
  • Flash Size:64MB
  • RAM Size:1GB
  • Connector Type:B2B
  • Size / Dimension:1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature:-

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TEM0007-01-CAA11-A

Overview

The TEM0007-01-CAA11-A is a System-on-Module manufactured by Trenz Electronic GmbH, designed for embedded digital signal processing and high-speed data acquisition applications. This module integrates the AMD Zynq UltraScale+ RFSoC FPGA, combining programmable logic with quad-core ARM Cortex-A53 processors and ARM Cortex-R5 real-time cores. It supports high-performance mixed-signal processing directly on the silicon fabric, making it suitable for complex radio frequency and communication systems requiring low-latency control and high throughput.

Feature Summary

  • Integrates AMD Zynq UltraScale+ RFSoC FPGA with integrated analog-to-digital and digital-to-analog converters
  • Combines programmable logic with dual-domain processing subsystems including ARM Cortex-A53 and Cortex-R5 cores
  • Designed for high-speed data acquisition and embedded digital signal processing in industrial environments

Applications

  • High-speed data acquisition systems
  • Embedded digital signal processing
  • Radio frequency front-end processing
  • Industrial measurement systems

Procurement Notes

Verify component availability through authorized distributors as end-of-life notifications may apply to specific revisions. Confirm mechanical compatibility with baseboards such as the TEB0724 series before procurement. Ensure that the specific suffix indicates the correct package and temperature grade required for the target application environment.

Selection Notes

Select this module when high-throughput mixed-signal processing is required within a compact form factor. The integration of RFSoC technology reduces external component count compared to discrete ADC/DAC solutions. Evaluate thermal management requirements due to the high performance of the Zynq UltraScale+ architecture. Consider the available development tools and software support provided by Trenz Electronic for Linux and bare-metal implementations.

Part Context

Trenz Electronic GmbH specializes in FPGA and SoC modules for industrial and automotive applications. The company provides comprehensive engineering services alongside its hardware portfolio. Modules are developed and manufactured in Germany, ensuring strict quality standards. The TEM0007 series represents their implementation of Xilinx/AMD Zynq UltraScale+ RFSoC technology for advanced signal processing tasks.

Replacement Considerations

Check for official product discontinuation notifications from Trenz Electronic. If the current revision is obsolete, consult the manufacturer for recommended next-generation alternatives within the TE08xx or similar series that maintain pin-out compatibility or require minimal board redesign.

TEM0007-01-CAA11-ATEM0007-01-CAA11-A
$227.80
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