TF2420VU-302Y2R0-01

$1.45

Description：CMC 2A 2LN TH
Series：TF
Mfr：TDK Corporation
Package：Bulk

SKU:8e5a0141c6bd Category: Common Mode Chokes Brand: TDK Corporation

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Product introduction

Product Detailed Parameters

Description：CMC 2A 2LN TH
Series：TF
Mfr：TDK Corporation
Package：Bulk
Filter Type：Power Line
Number of Lines：2
Current Rating (Max)：2A
DC Resistance (DCR) (Max)：110mOhm
Voltage Rating - DC：-
Voltage Rating - AC：-
Operating Temperature：-20°C ~ 120°C
Ratings：-
Approval Agency：-
Features：-
Mounting Type：Through Hole
Size / Dimension：0.906" Dia x 0.787" W (23.00mm x 20.00mm)
Height (Max)：-
Package / Case：Vertical, No Base, 4 PC Pin
Inductance @ Frequency：-
Impedance @ Frequency：-
Qualification：-
Grade：-

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TF2420VU-302Y2R0-01

Overview

The TF2420VU-302Y2R0-01 is a through-hole common mode choke manufactured by TDK Corporation. It features a vertical mounting configuration with an inductance of 3mH and a rated current of 2A. The component exhibits a maximum DC resistance of 110mΩ. Designed for line filtering applications, it complies with RoHS standards and maintains a typical moisture sensitivity level of 1.

Feature Summary

Vertical leaded construction for board mounting
Common mode noise suppression capability
RoHS compliant manufacturing

Applications

Line filtering
Electronic circuit noise reduction

Procurement Notes

Verify the specific datasheet version to confirm exact physical dimensions and terminal compatibility. Ensure the selected variant matches the required current rating and inductance tolerance for the target application environment.

Selection Notes

Select this component when vertical through-hole mounting is required for common mode interference suppression. Evaluate the 2A current rating against peak load conditions to ensure reliable operation without saturation.

Part Context

This part belongs to TDK's passive magnetic component portfolio, specifically within their line filter series. It serves as a fundamental element for electromagnetic interference mitigation in electronic assemblies requiring robust through-hole integration.