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The TFSZ06052460-3310A2X is a thin-film balun designed for RF applications. It operates within a frequency range of 2.3GHz to 2.69GHz, providing impedance transformation between 50 Ohm and 100 Ohm ports. The component utilizes a compact 0202 (0505 Metric) surface-mount package with four pads. It supports an operating temperature range from -40°C to +85°C.
Verify the specific datasheet version and mechanical dimensions against the target PCB layout. Confirm that the 0202 package size and pad configuration match the design requirements. Ensure the operating temperature range meets the environmental specifications of the final application.
Select this component when a small form factor is required for 2.3GHz to 2.69GHz operations. The 50/100 Ohm impedance ratio suits specific balanced circuit topologies. Consider the thin-film technology for consistent phase and amplitude characteristics in high-frequency designs.
This part belongs to TDK's TFS Thin-Film Balun series. These components are engineered for high-frequency RF signal processing. The series offers various impedance ratios and frequency ranges to support diverse wireless standards and communication protocols.
Consult official TDK documentation for direct substitutes. Verify electrical parameters such as insertion loss and return loss before considering alternative baluns. Ensure physical compatibility if replacing with different package sizes.
The TFSZ06052460-3310A2X provides a 50 Ohm to 100 Ohm impedance transformation.
The device operates effectively within the 2.3GHz to 2.69GHz frequency band.