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TFZVTR5.1B is listed in the Single Zener Diodes range at ChipApex. The manufacturer field lists Rohm Semiconductor. Its product description is DIODE ZENER 5.1V 500MW TUMD2M. Review the specifications below when checking this part for your BOM.
The TFZVTR5.1B is a single Zener diode manufactured by ROHM Semiconductor, designed for surface-mount applications in the SOD-323HE-2 package. It features a nominal Zener voltage of 5.1 V with a maximum power dissipation of 500 mW. The device supports a junction temperature up to 150 °C and operates within a storage temperature range of -55 °C to +150 °C. Key electrical characteristics include a test current of 10 mA and a maximum reverse leakage current of 200 nA.
Verify the specific ordering part number suffix against official ROHM documentation to ensure correct packaging and tape specifications. Confirm that the component meets all required AEC-Q101 qualification standards for your target application environment. Cross-reference the datasheet revision date to ensure access to the most current electrical parameters and mechanical dimensions before finalizing procurement orders.
Select this component when a 5.1 V Zener reference is needed in a compact SMD form factor. Ensure the 500 mW power rating aligns with the thermal management capabilities of the target PCB layout. Verify that the SOD-323HE-2 footprint matches the design board constraints and that the 150 °C junction temperature rating satisfies the operational thermal requirements of the system.
This component belongs to the TFZV series of Zener diodes from ROHM Semiconductor. The series is characterized by its small outline packages and high-reliability construction intended for demanding environments. The TFZVTR5.1B specifically utilizes the SOD-323HE-2 package code, distinguishing it from other series members that may use different casing styles or power ratings.
The EDZVFH5.1B is listed as a recommended replacement with similar specifications. Note that while the electrical performance is comparable, the EDZVFH5.1B uses an EMD2 (SOD-523) package, which differs physically from the SOD-323HE-2 package of the TFZVTR5.1B. Mechanical re-verification is required if substituting this part.
The maximum power dissipation is 500 mW at an ambient temperature of 25 °C.
Yes, the ultra-small mold type construction allows for automatic mounting using standard chip-mounters.
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