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— IC芯片 | 连接器 | 传感器 | 被动器件 —
The THP7312-B is an imaging signal processor manufactured by THine Solutions, Inc. It is housed in an 81-TFBGA package with dimensions of 8x8 mm. The component is designed for surface-mount assembly and falls under the specialized ICs category. This specific part number variant is associated with the THSCU101 UVC camera kit solution, which utilizes a 13-megapixel PDAF sensor. The device functions as the core image processing unit within this integrated hardware configuration.