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THS4221DBVR is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC OPAMP VFB 1 CIRCUIT SOT23-5. Review the specifications below when checking this part for your BOM.
The THS4221DBVR is a single-channel, low-distortion, high-speed voltage feedback operational amplifier manufactured by Texas Instruments. It features rail-to-rail output swing and operates from a single supply ranging from 3 V to 15 V or dual supplies of ±1.35 V to ±7.5 V. Key electrical parameters include a gain-bandwidth product of 120 MHz, a slew rate of 975 V/µs, and an open-loop voltage gain of 100 dB. The device draws a maximum quiescent current of 14 mA per channel and is housed in a five-lead SOT-23 (DBV) package.
Verify the specific DBV-5 package designation matches the required footprint. Confirm that the 'R' suffix indicates reel packaging if applicable to your assembly process. Ensure the component meets RoHS compliance requirements for your target market. Cross-reference the manufacturer part number against official datasheets to validate authenticity before integration.
Select this component when a single-channel amplifier with rail-to-rail output is required. Consider the THS4222 family variants if dual-channel functionality or power-down modes are needed instead. Evaluate thermal dissipation constraints as the SOT-23 package has limited heat sinking capabilities compared to larger packages.
This device belongs to the THS422x family of low-distortion, high-speed operational amplifiers. The family includes single-channel models like the THS4221 and dual-channel versions such as the THS4222. Variants like the THS4225 and THS4226 add power-down functionality. All share similar core electrical characteristics but differ in channel count and package options.
Direct substitutes within the same family include the THS4221DGN and THS4221DGK. These offer identical electrical specifications but utilize different packages (8-pin MSOP/HVSSOP). Verify pin compatibility and thermal management requirements when switching between the DBV, DGN, and DGK packages.
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