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TI135N484C4L is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Efinix, Inc.. Its product description is LINEAR IC. Review the specifications below when checking this part for your BOM.
The Efinix TI135N484C4L is a Titanium FPGA featuring 135K logic elements and 92 DSP blocks. It utilizes a 484-ball LFBGA package with an 18x18 mm footprint. The device supports I/O voltages from 1.14V to 3.6V and operates within a junction temperature range of 0°C to 100°C. Key specifications include 7,200 Kbits of embedded memory and support for high-speed serial interfaces up to 12.5 Gbps. The component is designed for complex digital logic applications requiring significant programmable interconnect and low-power operation.
Verify the specific suffix C4L against official Efinix documentation to confirm temperature grade and package variant. Ensure compatibility with required programming cables and software versions before procurement. Cross-reference the manufacturer part number with authorized distributors to avoid counterfeit components. Confirm RoHS compliance status based on the latest manufacturing data sheet revision.
Select this model when design requirements exceed the capacity of smaller Titanium devices but do not necessitate the largest family members. Evaluate power consumption profiles against available cooling solutions. Consider the availability of development kits for initial verification. Compare pin-out compatibility with existing board layouts if upgrading from previous generations.
This component belongs to the Titanium series, which targets mid-to-high-end FPGA applications. It shares architectural similarities with other Titanium parts but offers distinct resource counts. The 484-ball BGA package is common across several density levels within the family. Designers often choose this series for its balance of performance and power efficiency.
Direct substitutes are limited due to unique pinouts and resource configurations. Check Efinix's official obsolescence notices for potential end-of-life status. Alternative densities within the same package may require schematic modifications. Verify that any replacement maintains the required I/O voltage standards and timing constraints.
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