TI135N576I3

Field Programmable Gate Array Overview

The Efinix TI135N576I3 is a Titanium series Field Programmable Gate Array (FPGA) manufactured using a 16nm FinFET process. It features 135,000 logic elements and integrates 480 DSP blocks for high-performance signal processing. The device includes 9.2 Mbits of embedded SRAM and supports up to 576 I/O pins. Operating at a supply voltage range of 0.92V to 0.98V, it is housed in a 576-ball FCBGA package with a 0.8mm pitch. The component is rated for industrial temperature ranges from -40°C to +100°C junction temperature.

Field Programmable Gate Array Feature Summary

• Supports Gen4 PCIe interfaces for high-speed data transfer
• Includes dedicated MIPI-CSI and MIPI-DSY PHY ports for camera and display connectivity
• Features integrated LPDDR4/DDR3 memory controllers
• Provides hardware acceleration capabilities for AI inference tasks

Field Programmable Gate Array Applications

• Industrial automation and control systems
• Medical imaging equipment
• Wireless infrastructure base stations
• AI edge inference accelerators

Field Programmable Gate Array Procurement Notes

Verify the specific suffix 'I3' confirms the industrial temperature grade (-40°C to +100°C TJ). Confirm the package type matches the required PCB footprint. Check RoHS compliance status against current regulatory requirements. Ensure lead times align with project schedules as fabrication cycles may vary.

Field Programmable Gate Array Selection Notes

Select this model when designs require approximately 135k LEs with significant DSP density. Consider the 16nm process node for power efficiency compared to older technologies. Verify that the 576-ball package fits within the mechanical constraints of the target enclosure.

Field Programmable Gate Array Part Context

This part belongs to the Titanium family, representing Efinix's second-generation 16nm FPGA lineup. It succeeds earlier Trion devices and offers higher density than the Ti60 variant. The series targets applications needing low power consumption alongside high throughput for video and signal processing workloads.

Field Programmable Gate Array Replacement Considerations

Direct substitutes are limited due to unique architecture. Evaluate Ti170 variants for higher density needs or Ti60 for lower cost options. Cross-reference pinouts carefully as package dimensions differ across the Titanium family.