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TI135N676I3 is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Efinix, Inc.. Its product description is LINEAR IC. Review the specifications below when checking this part for your BOM.
The Efinix TI135N676I3 is a Titanium series Field Programmable Gate Array (FPGA) manufactured using a 16nm FinFET process. It features 135,000 logic elements and integrates 480 DSP blocks for high-performance signal processing. The device includes 9.2 Mbits of embedded SRAM and supports up to 80 general-purpose input/output pins. It operates within a supply voltage range of 0.92V to 0.98V and functions at junction temperatures between 0°C and 85°C. The component is housed in a 676-ball FineLine BGA package with dimensions of 25mm x 25mm.
Verify the specific suffix 'I3' against official Efinix documentation to confirm industrial temperature rating and quality standards. Ensure compatibility with existing PCB footprints for the 676-ball FBGA package. Confirm lead times as manufacturing schedules may vary. Validate RoHS compliance status for your region before finalizing procurement orders.
Select this model when designs require moderate FPGA density combined with specialized media interfaces like MIPI and PCIe. Compare total logic resources and DSP block counts against lower-density Titanium variants if cost or power constraints are primary drivers. Evaluate the integrated RISC-V core capabilities if on-chip processing is required alongside programmable logic.
This component belongs to the Efinix Titanium family, representing second-generation 16nm FPGAs. It succeeds earlier 40nm Trion devices and offers significant improvements in density and feature sets. The TI135 variant sits within the mid-range of the Titanium lineup, balancing resource availability with power efficiency for complex embedded applications.
No direct public substitute part numbers are confirmed for this specific configuration. Cross-referencing with other Titanium series members requires careful evaluation of pinout compatibility and resource scaling. Alternative vendors should be assessed based on functional equivalence rather than direct pin-to-pin replacement.
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