TI135N676I3L

Field Programmable Gate Array Overview

The TI135N676I3L is a Field Programmable Gate Array (FPGA) belonging to the Efinix Trident family. It utilizes a 40nm process technology and features a TriMatrix architecture integrating embedded Flash, DSP blocks, and SRAM. The device provides 135K logic elements and supports high-speed serial transceivers for data communication applications. It is housed in a lead-free FBGA-676 package with an industrial temperature range rating of -40°C to +85°C.

Field Programmable Gate Array Feature Summary

• TriMatrix architecture combining embedded Flash memory, DSP slices, and SRAM on a single die
• Supports non-volatile configuration via embedded Flash without external boot devices
• Integrated high-speed serial transceivers for advanced connectivity
• Industrial temperature operation capability

Field Programmable Gate Array Applications

• High-speed data acquisition systems
• Industrial automation controllers
• Test and measurement equipment
• Medical imaging signal processing

Field Programmable Gate Array Procurement Notes

Verify the specific suffix 'I3L' against official Efinix documentation to confirm the exact speed grade and temperature range. Ensure the ordering part number matches the required package variant and that the component is sourced from authorized distributors to guarantee authenticity and traceability.

Field Programmable Gate Array Selection Notes

Select this model when a non-volatile FPGA solution is required to eliminate external configuration flash components. Evaluate the available I/O count and DSP resources against the target design complexity. Confirm that the 40nm process node meets the power consumption and performance requirements for the intended application environment.

Field Programmable Gate Array Part Context

This component is part of the Efinix Trident series, designed for mid-range FPGA applications requiring embedded Flash capabilities. It competes with other non-volatile FPGA offerings in the market, providing a balance between programmability and system integration by reducing board space and bill of materials through internal memory storage.