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TI180G400C3L is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Efinix, Inc.. Its product description is LINEAR IC. Review the specifications below when checking this part for your BOM.
The TI180G400C3L is a Titanium FPGA from Efinix, Inc., housed in a 400-ball BGA package. It features the 74HVIO standard and includes 640 DSP blocks for high-performance signal processing. This device supports MIPI interfaces with data lane widths of x1, x2, x4, and x8, enabling multi-sensor AI pipelines. The component is designed to deliver power, performance, and area advantages over traditional FPGA technologies, facilitating real-time decision-making and compute-intensive workloads at the edge.
Verify the specific ordering suffix C3L against the manufacturer's official documentation to ensure correct speed grade and temperature range compatibility. Confirm that the 400-ball BGA package aligns with your PCB layout constraints. Cross-reference the 74HVIO standard support requirements with your system's I/O voltage levels. Ensure the lead time of 28 weeks is factored into your production schedule. Validate that the DSP block count meets your algorithmic complexity needs before finalizing procurement.
Select this model when high I/O density is required within a compact 400-ball footprint. The inclusion of 640 DSP blocks makes it suitable for applications demanding significant signal processing capabilities. Consider the MIPI interface support if your design involves multi-sensor data acquisition. Evaluate the power and performance advantages relative to traditional FPGA technologies for edge deployment scenarios. Ensure the specific speed grade associated with the C3L suffix matches your timing requirements.
The TI180G400C3L belongs to the Titanium FPGA family by Efinix, Inc., which is engineered for edge AI deployments and real-time processing. This family emphasizes low power consumption and compact System-in-Package integration. The Titanium architecture provides advanced security features alongside its computational capabilities. Devices in this series are positioned to solve performance challenges in next-generation edge applications requiring efficient data analysis.
Public confirmed substitute part numbers are not available in the provided documentation.
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