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TI35F100S3F2I3L is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Efinix, Inc.. Its product description is LINEAR IC. Review the specifications below when checking this part for your BOM.
The TI35F100S3F2I3L is a Field Programmable Gate Array (FPGA) belonging to the Trident™ II family by Efinix, Inc. It features a logic density of 35K LEs and utilizes a 40nm process technology. The device includes embedded memory blocks totaling 1.8 Mbits and supports high-speed serial transceivers for data communication. It operates within an industrial temperature range of -40°C to +100°C and is housed in a 324-ball FineLine BGA package with a 0.8mm pitch. Key specifications include support for JTAG debugging interfaces and multiple I/O standards.
Verify the specific suffix codes against official Efinix documentation to ensure correct package type, temperature grade, and industrial qualification status. Confirm lead times and availability directly with authorized distributors as supply chain conditions vary. Ensure proper handling procedures are followed due to the fine-pitch ball grid array packaging.
Select this component when a moderate logic density with embedded memory and high-speed serial interfaces is required. Compare against other Trident II variants based on pin count and I/O flexibility needs. Consider power consumption profiles and thermal management requirements for the target application environment before finalizing the choice.
This part belongs to the Efinix Trident™ II FPGA family, designed for cost-sensitive applications requiring low power consumption and small form factors. The series targets industries needing reliable programmable logic with integrated connectivity options. It complements higher-end FPGAs by offering a balance between performance and resource efficiency for mid-range complexity designs.
Check for direct pin-to-pin compatible alternatives within the same Trident II family with different package options. Evaluate cross-vendor solutions only if architectural compatibility allows for firmware adaptation. Verify that any substitute maintains the required operating temperature range and interface speeds.
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