TI60F100S3F2I3L

Field Programmable Gate Array Overview

The TI60F100S3F2I3L is a Titanium™ Field Programmable Gate Array (FPGA) IC manufactured by Efinix, Inc. It features 62,016 logic elements and 61 High-Speed I/Os (HSIO). The device integrates 2,726,298 total RAM bits and includes three Phase-Locked Loops (PLLs). It operates within a supply voltage range of 0.92V to 0.98V and supports an operating temperature range of -40°C to 100°C (TJ). The component is housed in a 100-TFBGA package with dimensions of 5.5x5.5 mm.

Field Programmable Gate Array Feature Summary

• Utilizes the Quantum™ computing architecture for high density and low power consumption.
• Supports flexible configuration via SPI, JTAG, and internal reconfiguration capabilities.
• Includes Single Event Upset (SEU) detection to enhance system reliability against high-energy particles.

Field Programmable Gate Array Applications

• Mobile devices requiring always-on functionality
• Edge computing systems
• AI IoT sensor fusion applications

Field Programmable Gate Array Procurement Notes

Verify the specific suffix 'S3F2I3L' against the official Efinix datasheet to confirm the exact pinout, speed grade, and industrial temperature rating. Ensure compatibility with the Efinity® software design flow before procurement. Confirm that the 100-TFBGA footprint matches the target PCB land pattern specifications.

Field Programmable Gate Array Selection Notes

Select this model when a compact 100-pin form factor is required alongside significant logic capacity. The industrial temperature range (-40°C to 100°C) makes it suitable for harsh environments. Verify that the 61 HSIO count meets interface requirements, noting support for LVDS, MIPI, and other differential signaling standards up to 1.5Gbps.

Field Programmable Gate Array Part Context

This part belongs to the Titanium™ series from Efinix, designed for high-density, low-power applications. It shares the core Quantum™ architecture with other Ti60 variants but differs in I/O count and packaging. The series targets mobile and edge AI markets where power efficiency and small size are critical constraints.

Field Programmable Gate Array Replacement Considerations

Check for other Ti60 family members with different I/O counts or packages if pin compatibility is not required. Verify if the non-industrial temperature variant suffices for cost reduction. No direct cross-manufacturer substitutes are documented; consider FPGA families with similar logic density and I/O flexibility.