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TI60F225C3L is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Efinix, Inc.. Its product description is FPGA TITAN140HSIO 4PLL LP 225BGA. Review the specifications below when checking this part for your BOM.
The Efinix TI60F225C3L is a Field Programmable Gate Array (FPGA) belonging to the Trident II family, designed for high-density logic applications. It features 61,440 Logic Elements and supports up to 2,880 DSP slices with 36-bit MACs. The device includes 7.2 Mb of embedded memory and integrates four Gigabit Transceivers operating at speeds up to 12.5 Gbps. It utilizes a 225-ball FineLine BGA package with a 0.65 mm pitch, ensuring compact form factors for industrial and commercial deployments.
Verify the specific suffix codes against official Efinix documentation to confirm package type, temperature range, and lead-free status. Ensure compatibility with required programming interfaces and JTAG chain configurations before procurement. Cross-reference part numbers with authorized distributors to avoid counterfeit components.
Evaluate the TI60F225C3L against larger or smaller Trident II variants based on Logic Element density and DSP slice requirements. Consider thermal management solutions suitable for the FineLine BGA package in enclosed environments. Verify that the selected development tools support the specific device revision and configuration bitstream formats.
This component is part of the Efinix Trident II FPGA portfolio, which targets mid-to-high density applications. It shares architectural similarities with other devices in the series but offers distinct resource counts and pinout configurations tailored for specific board designs and performance needs within the industrial sector.
Direct pin-to-pin replacements are limited within the Trident II family due to varying I/O counts and resource densities. Evaluate alternative FPGAs from different manufacturers only if architectural flexibility allows for significant PCB redesign and firmware adaptation.
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