TI85N676C3L

Field Programmable Gate Array Overview

The Efinix TI85N676C3L is a Field Programmable Gate Array (FPGA) belonging to the Trident II family. It features 85,000 logic elements and supports up to 676 I/O pins within a 676-ball FineLine BGA package. The device integrates 126 DSP slices for high-performance signal processing and includes embedded memory resources totaling 4.9 Mbits. It operates with supply voltages ranging from 1.14V to 1.26V and supports industrial temperature ranges.

Field Programmable Gate Array Feature Summary

• Supports advanced low-power manufacturing processes for energy efficiency
• Integrates dedicated hardware blocks for digital signal processing tasks
• Provides extensive connectivity options through a high-density pin count
• Includes embedded memory structures for data storage and buffering

Field Programmable Gate Array Applications

• Industrial automation control systems
• Telecommunications infrastructure equipment
• Medical imaging signal processing units
• Test and measurement instrumentation

Field Programmable Gate Array Procurement Notes

Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm the specific suffix indicates the correct temperature grade and packaging variant. Request official traceability documentation to ensure compliance with quality standards. Check for recent product change notifications regarding material composition or sourcing updates.

Field Programmable Gate Array Selection Notes

Evaluate the available logic density against the complexity of the target design to ensure sufficient resources. Assess the I/O requirements to confirm the package provides adequate connectivity. Review power consumption specifications to validate thermal management capabilities within the final enclosure constraints.

Field Programmable Gate Array Part Context

This component is part of the Efinix Trident II FPGA portfolio, designed for mid-range applications requiring significant programmable logic and DSP capabilities. It serves as a scalable solution for designs transitioning from lower-density FPGAs or ASIC prototypes, offering flexibility in system architecture development.