TI85N676C4

Field Programmable Gate Array Overview

The TI85N676C4 is a Trion FPGA from Efinix, Inc., designed for MIPI CSI-2 applications. It features 130 I/Os and operates within a supply voltage range of 1.05V to 1.15V. The device contains 84,096 logic elements and 4,152,320 total RAM bits. It is housed in a 324-TFBGA package with dimensions of 12x12 mm. The component supports an operating temperature range of -40°C to 100°C (TJ) and has a Moisture Sensitivity Level (MSL) of 3 (168 hours).

Field Programmable Gate Array Feature Summary

• Integrated MIPI CSI-2 interface capabilities for image sensor connectivity.
• High-density embedded memory architecture supporting complex data buffering.
• Industrial-grade thermal performance suitable for demanding environments.

Field Programmable Gate Array Applications

• Machine vision systems requiring MIPI CSI-2 input.
• Image processing pipelines in industrial automation.
• Video surveillance hardware utilizing high-speed serial interfaces.

Field Programmable Gate Array Procurement Notes

Verify the specific suffix 'C4' against official Efinix documentation to confirm the commercial temperature grade and package variant. Ensure compatibility with the required MIPI CSI-2 lane configuration and power delivery specifications before finalizing procurement orders.

Field Programmable Gate Array Selection Notes

Select this model when MIPI CSI-2 integration is mandatory within the Trion family. Compare the 84,096 logic element count against design requirements. Verify that the 324-TFBGA footprint fits the target PCB layout constraints.

Field Programmable Gate Array Part Context

This part belongs to the Efinix Trion series, which focuses on low-power, cost-effective FPGA solutions. The TI85N variant specifically targets applications requiring dedicated MIPI interfaces, distinguishing it from standard Trion models like the T85F324.

Field Programmable Gate Array Replacement Considerations

Direct substitutes are not publicly confirmed. Evaluate other Trion devices with similar logic density and FBGA packaging if MIPI support is not strictly required by the design.