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TI90G529I3 is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Efinix, Inc.. Its product description is FPGA TITAN 80GPIO 336DSP 529BGA. Review the specifications below when checking this part for your BOM.
The TI90G529I3 is a Titanium series Field Programmable Gate Array (FPGA) manufactured by Efinix, Inc. It features 104 input/output pins and utilizes a 529-ball FineLine BGA package with dimensions of 25x25 mm. The device contains 106,872 logic elements and provides 8,064 DSP slices for signal processing tasks. Total embedded memory capacity reaches 7,560,000 bits. Operating voltage ranges from 0.92V to 0.98V, with an industrial temperature range of 0°C to 85°C junction temperature. This component supports high-density programmable logic applications requiring significant computational throughput within a compact form factor.
Verify the specific suffix I3 indicates the industrial temperature grade during sourcing. Confirm package availability matches the 529-ball FineLine BGA requirement. Check current manufacturing status as supply conditions may vary. Ensure compatibility with required programming tools and software versions before finalizing procurement decisions.
Compare total logic element counts against project complexity requirements. Evaluate DSP slice quantity relative to algorithmic demands. Assess pin count adequacy for interface connections. Consider thermal management needs given the operating temperature specifications. Verify power supply voltage compatibility with existing system rails.
This component belongs to the Titanium FPGA family, designed for mid-to-high density applications. It represents a generation of devices focusing on integrated DSP performance alongside general-purpose programmable logic. The series targets markets requiring flexible hardware acceleration and custom logic implementation in space-constrained environments.
Direct substitutes within the same Titanium family should be evaluated based on pin compatibility and resource scaling. Cross-vendor replacements require careful interface and logic architecture mapping. Verify electrical characteristics match original design constraints when considering alternative sources.
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