TI90J361I3

Field Programmable Gate Array Overview

The TI90J361I3 is a Titanium™ series Field Programmable Gate Array (FPGA) manufactured by Efinix, Inc. It features 54 I/Os and contains 72,864 logic elements within a 324-LFBGA package. The device includes 4,915,200 total RAM bits and 56 DSP blocks. It operates on a supply voltage of 0.92V to 0.98V and supports a junction temperature range of 0°C to 85°C.

Field Programmable Gate Array Feature Summary

• Titanium architecture with integrated DSP capabilities
• High-density embedded memory resources
• Surface-mount LFBGA packaging for compact integration

Field Programmable Gate Array Applications

• Industrial automation control systems
• Telecommunications infrastructure equipment
• Test and measurement instrumentation

Field Programmable Gate Array Procurement Notes

Verify the specific suffix 'I3' against official Efinix documentation to confirm industrial temperature rating and pinout compatibility. Ensure the 324-LFBGA footprint matches the target PCB design. Confirm RoHS3 compliance status through the manufacturer's current datasheet before finalizing procurement specifications.

Field Programmable Gate Array Selection Notes

Select this model when 72,864 logic elements and 56 DSP blocks are required in a 324-pin form factor. Compare total RAM capacity of approximately 4.9 Mbits against application needs. Verify that the 0.92V-0.98V core voltage aligns with available power rails in the system design.

Field Programmable Gate Array Part Context

This component belongs to the Titanium family of FPGAs from Efinix. It shares architectural similarities with other Titanium parts but differs in I/O count, logic density, and package size. The TI90J361I3 represents a mid-range option within the series, balancing resource availability with package constraints.

Field Programmable Gate Array Replacement Considerations

Check Efinix's official obsolescence notices for direct replacements. Cross-reference pin-compatible Titanium devices with similar logic counts if sourcing issues arise. Verify that any substitute maintains the same LFBGA footprint and electrical characteristics.