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TI90L484C3L is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Efinix, Inc.. Its product description is LINEAR IC. Review the specifications below when checking this part for your BOM.
The TI90L484C3L is a Titanium series Field Programmable Gate Array (FPGA) manufactured by Efinix, Inc. It features a logic capacity of 90K LEs and includes integrated DSP blocks for signal processing applications. The device utilizes a 484-pin FineLine BGA package with a 1.25mm pitch, designed for surface-mount assembly. Key electrical specifications include a supply voltage range of 0.92V to 0.98V for the core and a maximum operating junction temperature of 100°C. The component supports high-speed serial interfaces and is suitable for complex digital logic implementations requiring moderate density and power efficiency.
Verify the specific suffix 'C3L' against official Efinix documentation to confirm speed grade and commercial temperature range specifications. Ensure compatibility with the Efinity IDE software version required for the Titanium family. Check for any recent Product Change Notifications (PCNs) regarding packaging or material compliance updates before finalizing procurement orders.
Select this model when a balance between logic density and power consumption is required for mid-range FPGA applications. Compare pin count and I/O voltage levels against system requirements. Consider the availability of development kits for prototyping. Evaluate thermal performance constraints based on the 484-pin BGA package size and ambient operating conditions.
This component belongs to the Titanium FPGA family from Efinix, which targets cost-sensitive and power-efficient designs. It sits within the product portfolio alongside higher-density models like the TI180 series. The Titanium line emphasizes ease of use through the Efinity toolchain and offers competitive performance for embedded logic and DSP tasks in compact form factors.
Direct substitutes may include other Efinix Titanium devices with similar logic counts and package types, such as the TI60L484C3L for lower density or TI180 variants for higher capacity. Cross-vendor replacements require careful analysis of pin compatibility, I/O standards, and programming interface differences.
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