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The TIBPAL16R4-10CN is a high-performance IMPACT-X PAL programmable logic device featuring eight dedicated inputs, four registered outputs with three-state buffers, and six I/O lines. It operates at a maximum frequency of 62.5 MHz without feedback and 55.5 MHz with feedback. Propagation delay from input to output is 10 ns max, while clock-to-Q delay is 8 ns max. The device supports a 5 V supply, functions within a 0°C to 75°C temperature range, and utilizes titanium-tungsten fuses for configuration.
Verify component authenticity through authorized Texas Instruments distributors or certified secondary market suppliers like Rochester Electronics. Confirm that the plastic DIP package matches the required pinout and physical dimensions. Ensure the device meets RoHS3 compliance standards if applicable to the manufacturing environment. Check for any specific lot traceability requirements mandated by the end-use industry regulations.
Select this variant when registered outputs with three-state buffering are required for system bus sharing. Choose the C suffix for commercial temperature ranges rather than the M suffix intended for military specifications. Ensure the design accommodates the specific preload and power-up reset timing constraints defined in the datasheet. Verify that the 10 ns propagation delay meets the system's critical path requirements.
This component belongs to the TIBPAL16 series of IMPACT-X PAL circuits, which serve as functional equivalents to earlier PAL devices but offer improved speed. The R4 designation specifically indicates a configuration with registered outputs and three-state control. These devices are designed to replace conventional TTL logic, offering more compact circuit board designs through easy programmability and higher integration density.
Direct replacements include other TIBPAL16R4 variants with different speed grades or temperature ratings, such as the TIBPAL16R4-25CN. Designers must verify that alternative speed grades meet the minimum timing requirements of the target application. Package compatibility should be confirmed when substituting between plastic and ceramic DIP options.