TIBPAL16R6-10CFN

TIBPAL16R6-10CFN

$1.62
  • Description:IC PLD 10NS 20PLCC
  • Mfr:Texas Instruments

SKU:3c3c8445cdff Category: Brand:

  
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Product Detailed Parameters

  • Description:IC PLD 10NS 20PLCC
  • Mfr:Texas Instruments
  • Package:Tube
  • Series:IMPACT-X™ PAL®
  • Programmable Type:PAL
  • Number of Macrocells:-
  • Voltage - Input:5V
  • Speed:10 ns
  • Mounting Type:Surface Mount
  • Package / Case:20-LCC (J-Lead)
  • Supplier Device Package:20-PLCC (9x9)

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TIBPAL16R6-10CFN

Overview

The TIBPAL16R6-10CFN is a high-performance IMPACT-X PAL circuit manufactured by Texas Instruments. It features an 8-input, 6 registered output, and 2 I/O pin configuration within a 20-pin Plastic Chip Carrier (FN package). The device operates at a minimum frequency of 55.5 MHz with feedback and 62.5 MHz without feedback. Propagation delay from input to output is 10 ns maximum, while clock-to-Q delay is 8 ns maximum. It utilizes Advanced Low-Power Schottky technology and titanium-tungsten fuses for reliable performance.

Feature Summary

  • High-speed operation with 55.5 MHz minimum frequency under feedback conditions
  • Preload capability on output registers simplifies testing sequences
  • Power-up clear feature sets all register outputs to low level initially
  • Security fuse prevents unauthorized duplication of the programmed logic

Applications

  • State machine implementation requiring registered outputs
  • Synchronization circuits utilizing flip-flop characteristics
  • Custom logic functions replacing conventional TTL logic

Procurement Notes

Verify the specific suffix 'CFN' corresponds to the Plastic Chip Carrier package variant. Confirm the temperature range matches the 'C' suffix specification of 0°C to 75°C. Ensure programming equipment supports the titanium-tungsten fuse architecture described in the datasheet.

Selection Notes

Select this model when six registered outputs are required alongside two bidirectional I/O lines. The 10-ns speed grade suits applications needing faster performance than standard PAL devices. Consider the FN package footprint if board space reduction is necessary compared to DIP options.

Part Context

This component belongs to the TIBPAL16L8/R4/R6/R8 series of IMPACT-X PAL circuits. It shares the same core architecture and fuse technology as other members like the TIBPAL16R4 and TIBPAL16R8, differing primarily in the number of registered outputs and I/O pins available.

Replacement Considerations

Functionally equivalent parts include the TIBPAL16R6-12M for military temperature ranges or the TIBPAL16R6-10C for plastic DIP packages. Verify pin compatibility and electrical specifications before substitution.

TIBPAL16R6-10CFNTIBPAL16R6-10CFN
$1.62
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