TIBPAL16R8-30MWB

Overview

The TIBPAL16R8-30MWB is a Low-Power High-Performance IMPACT PAL circuit manufactured by Texas Instruments. It features 8 dedicated inputs, 8 registered outputs with 3-state buffers, and operates within the full military temperature range of -55°C to 125°C. The device utilizes titanium-tungsten fuses for programmability and provides a maximum propagation delay of 30 ns from input to output. It functions as a high-speed substitute for conventional TTL logic, offering reliable performance in compact designs.

Feature Summary

• Military-grade operation across -55°C to 125°C
• Low-power Advanced Low-Power Schottky technology
• Registered outputs with power-up clear feature
• Titanium-tungsten fuse programmability

Applications

• State machine implementation
• Address decoding
• Bus protocol conversion
• Register file interfaces

Procurement Notes

Verify the specific ordering suffix 'W' corresponds to the CFP (Ceramic Flat Package) housing before procurement. Confirm that the military temperature rating (-55°C to 125°C) aligns with system requirements, as commercial variants exist with narrower ranges. Ensure programming equipment supports the titanium-tungsten fuse architecture specified for this IMPACT series.

Selection Notes

Select the TIBPAL16R8-30MWB when registered outputs are required alongside 3-state buffering capabilities. The '30' suffix indicates a maximum 30 ns propagation delay, suitable for moderate-speed synchronous designs. Compare against the 'C' suffix variants if the application does not require full military temperature coverage, as those offer faster switching speeds.

Part Context

This component belongs to the TIBPAL16 family of Simple Programmable Logic Devices (SPLDs). It is functionally equivalent but faster than the legacy PAL16R8A series. The device integrates an AND-OR array with registered outputs, allowing for complex combinatorial and sequential logic implementation within a single 20-pin package.

Replacement Considerations

Public confirmed substitutes include TIBPAL16R8-30MJB (CDIP package) and TIBPAL16R8-30MFKB (LCCC package). Verify pinout compatibility and thermal characteristics when substituting between different package types.