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The Bourns TIC263S is a silicon TRIAC belonging to the TIC263 series, housed in an SOT-93 package. It features a glass-passivated wafer and supports a repetitive peak off-state voltage (VDRM) of 700 V. The device handles a full-cycle RMS on-state current (IT(RMS)) of 25 A at case temperatures up to 60°C, with a peak on-state surge current (ITSM) of 175 A. Maximum gate trigger current (IGT) is specified at 50 mA for quadrants 1 through 3. Operating case temperature ranges from -40°C to +110°C, while storage temperature extends to -40°C/+125°C.
Verify component authenticity by checking manufacturer markings against official datasheet specifications. Confirm package type matches SOT-93 requirements. Ensure thermal management design accommodates the specified junction-to-case thermal resistance. Validate that operating voltages remain within the 700 V limit. Check for obsolete status indicators as availability may be restricted.
Select this component when a 700 V blocking voltage and 25 A continuous current rating are required in a compact surface-mount form factor. Consider the SOT-93 package constraints for PCB layout and heat dissipation. Evaluate gate drive requirements against the 50 mA maximum trigger current specification. Ensure the application environment stays within the -40°C to +110°C operating case temperature range.
The TIC263S is part of the broader TIC263 series of high-current silicon TRIACs manufactured by Bourns. This series includes variants with different voltage ratings, such as the TIC263D (400 V), TIC263M (600 V), and TIC263N (800 V). All members share common electrical characteristics regarding current handling and thermal performance, differing primarily in their off-state voltage capabilities.
Direct replacements must match the 700 V rating, 25 A current capacity, and SOT-93 package. Verify pinout compatibility, specifically noting that Pin 2 connects to the mounting base. Cross-reference thermal resistance values to ensure equivalent heat dissipation performance in the target application.