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Product Detailed Parameters
- Description：OPTOISO 5.3KV 1CH TRANS W/BASE
- Series：TIL111
- Mfr：Isocom Components 2004 LTD
- Package：Tube
- Number of Channels：1
- Voltage - Isolation：5300Vrms
- Current Transfer Ratio (Min)：20% @ 16mA
- Current Transfer Ratio (Max)：-
- Turn On / Turn Off Time (Typ)：-
- Rise / Fall Time (Typ)：2µs, 2µs
- Input Type：DC
- Output Type：Transistor with Base
- Voltage - Output (Max)：30V
- Current - Output / Channel：50mA
- Voltage - Forward (Vf) (Typ)：1.2V
- Current - DC Forward (If) (Max)：60 mA
- Vce Saturation (Max)：400mV
- Operating Temperature：-55°C ~ 100°C
- Mounting Type：Surface Mount
- Package / Case：6-SMD, Gull Wing
- Supplier Device Package：-
- Grade：-
- Qualification：-
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Overview
The TIL111XSM is a single-channel optically coupled isolator manufactured by Isocom Components 2004 LTD. It integrates an infrared light-emitting diode with an NPN silicon phototransistor featuring a base terminal for improved switching performance. The device utilizes a surface-mount DIP package with six pins, designed for direct PCB mounting. Key electrical specifications include a maximum forward voltage of 1.65V and a maximum input current of 60 mA. It offers a high isolation voltage of 5.3 kVrms to ensure signal integrity between isolated circuits. The typical rise time is 2µs, while the typical fall time is 11µs, supporting standard digital isolation applications.
Feature Summary
- Integrates an infrared LED with an NPN silicon phototransistor that includes a base terminal for enhanced control.
Applications
- Digital signal isolation in microprocessor systems
- Gate drive circuits for power electronics
- Isolated data transmission interfaces
Procurement Notes
Verify the specific suffix XSM confirms the surface-mount DIP configuration and pinout compatibility with your design footprint. Confirm that the 5.3 kVrms isolation rating meets your safety standards requirements. Ensure the 60 mA maximum input current limit is respected in your circuit design to prevent component damage. Cross-reference the datasheet for thermal derating curves if operating near maximum ratings.
Selection Notes
Select this component when a phototransistor output with a base terminal is required for faster switching or better linearity compared to standard versions. The surface-mount DIP format facilitates automated assembly processes. Consider the 2µs rise time for timing-sensitive applications. Verify that the 5.3 kVrms isolation voltage aligns with your system's safety insulation requirements.
Part Context
The TIL111XSM belongs to the TIL111 series of optocouplers from Isocom Components 2004 LTD. This series is characterized by the use of an NPN silicon phototransistor with a base connection, distinguishing it from variants without base terminals. The XSM suffix denotes the surface-mount packaging variant within the broader TIL111 product family.
Replacement Considerations
Publicly confirmed substitute part numbers are not available in the provided source material. Verify pinout compatibility and electrical parameters before considering generic equivalents.
