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The TIL117TM is a single-channel transistor output optocoupler manufactured by onsemi. It features an NPN phototransistor with a base terminal for enhanced switching performance. The device utilizes a 6-pin MDIP (Mini-Dual In-Line Package) suitable for through-hole mounting. Key electrical specifications include a maximum collector-emitter voltage of 30V and a forward current rating of 60mA. The unit provides high isolation capability with a rated insulation voltage of 4170 Vrms or 7500V peak, depending on certification standards. It operates within a temperature range of -40°C to +100°C.
Verify the specific suffix designation when ordering, as packaging formats may vary between bulk and tube quantities. Confirm that the required insulation voltage rating aligns with the target application's safety compliance needs. Ensure the through-hole footprint matches the PCB layout constraints. Cross-reference the datasheet for the latest thermal derating curves to maintain reliability under varying ambient conditions.
Choose this component when fast switching speed is critical due to the presence of the base emitter connection. Compare against similar TIL series devices if higher current transfer ratios are needed. Consider the physical dimensions of the 6-pin DIP package for space-constrained designs. Evaluate the operating temperature range to ensure suitability for harsh environmental conditions without additional cooling measures.
The TIL117TM belongs to the TIL series of optocouplers from onsemi, designed for general-purpose isolation tasks. This series is widely used in legacy and modern industrial equipment. The TM variant specifically denotes the through-hole DIP package configuration. It serves as a reliable solution for galvanic isolation in power supplies and control logic interfaces.
Direct substitutes include the TIL117M for equivalent performance in different packaging or the TIL117SR2VM for surface-mount requirements. Verify pinout compatibility and electrical parameters before swapping. Check for any changes in safety certifications or package dimensions that might affect existing board layouts.