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TL16C750PM is listed in the UARTs (Universal Asynchronous Receiver Transmitter) range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC UART W/64-BYTE FIFO 64-LQFP. Review the specifications below when checking this part for your BOM.
The TL16C750PM is a single Universal Asynchronous Receiver/Transmitter (UART) interface integrated circuit manufactured by Texas Instruments. It operates within a supply voltage range of 3 V to 5.25 V, supporting both 3.3 V and 5 V logic levels. The device features a 64-byte transmit and receive FIFO buffer to enhance data throughput and reduce CPU overhead. It supports baud rates up to 1 Mb/s and includes automatic flow control capabilities. Packaged in a 64-pin LQFP format, it is designed for surface mount applications with an operating temperature range from 0°C to +70°C.
Verify the specific ordering suffix against official Texas Instruments documentation to ensure correct package type and temperature grade. Confirm RoHS compliance status and moisture sensitivity level requirements prior to procurement. Ensure the supplier provides valid traceability documents matching the manufacturer's part identification standards.
Select this component when a single-channel UART with substantial buffering is required for embedded designs. Consider the 64-pin LQFP footprint constraints during PCB layout planning. Verify that the system's power supply stability aligns with the specified 3 V to 5.25 V operational range to maintain signal integrity at high baud rates.
This component belongs to the TL16C750 family of UART controllers, which are widely used in legacy and modern industrial interfaces. The PM suffix specifically denotes the 64-lead Low Profile Quad Flat Package variant. It serves as a direct replacement for older 16550-compatible UARTs while offering significantly improved performance through integrated FIFO memory structures.
The TL16C750PMG4 is a verified lead-free alternative within the same product family. Both parts share identical functional specifications and pinouts. Verify package compatibility and thermal characteristics before substituting components in existing designs.
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