TLC555CPWR

Overview

The TLC555CPWR is a single-channel CMOS timer manufactured by Texas Instruments, utilizing the LinCMOS process. It operates within a supply voltage range of 2V to 15V and supports frequencies up to 2.1MHz. The device features low power consumption with a typical supply current of 360µA at 5V. It provides high output drive capability, sourcing 10mA and sinking 100mA. Packaged in an 8-pin TSSOP (PowerPAD) surface-mount format, it functions as a drop-in replacement for NE555 timers while offering improved timing precision due to lower input bias currents.

Feature Summary

• LinCMOS technology enables ultra-low power consumption (approx. 1mW at 5V).
• High output drive strength: 100mA sink / 10mA source.
• Rail-to-rail CMOS output compatible with TTL, CMOS, and MOS logic.
• Operates from 2V to 15V single supply with frequencies up to 2.1MHz.

Applications

• Precision timing and pulse generation circuits.
• PWM (Pulse Width Modulation) controllers.
• Time delay and sequential timing applications.
• Linear ramp generator designs.

Procurement Notes

Verify the package type matches the design requirements, as the 'PWR' suffix indicates a PowerPAD TSSOP package which differs physically from standard SOIC or DIP variants. Confirm thermal management needs for the exposed pad if operating near maximum ratings. Check RoHS compliance status on the specific manufacturer datasheet revision prior to ordering.

Selection Notes

Select this component when low static current is critical compared to bipolar NE555 alternatives. Ensure the PCB layout accommodates the PowerPAD thermal pad for adequate heat dissipation. Verify that the required output current does not exceed the 100mA sink limit under all load conditions.

Part Context

This part belongs to the TLC555 family of CMOS timers, designed to replace traditional bipolar 555 timers like the NE555. The 'CPWR' designation specifically identifies the commercial temperature range (0°C to 70°C) and the TSSOP-8 PowerPAD package style offered by Texas Instruments.

Replacement Considerations

Functionally interchangeable with NE555, LM555, and LMC555 devices regarding pinout and basic operation. Note that physical footprint differences exist between TSSOP-PowerPAD and standard SOIC/DIP packages; reflow soldering profiles must account for the exposed thermal pad.