TLC59212IN

Overview

The TLC59212IN is an 8-bit DMOS sink driver manufactured by Texas Instruments, housed in a 20-pin PDIP package. It operates within a supply voltage range of 3 V to 5.5 V and supports a maximum output current of 200 mA per channel. The device features a boost topology with a maximum output voltage of 30 V and functions at frequencies up to 1 MHz. Designed for through-hole mounting, it ensures reliable performance across an extended temperature range from -40°C to +85°C.

Feature Summary

• Integrates an 8-bit shift register and data latch for serial data input handling
• Provides constant current mode outputs via DMOS process technology
• Includes thermal shutdown circuitry to protect against overheating conditions

Applications

• LED display systems requiring high-current sinking capabilities
• General-purpose LED lighting driver circuits
• Industrial control panels with indicator arrays

Procurement Notes

Verify the specific suffix 'IN' corresponds to the PDIP-20 through-hole package variant rather than surface-mount options. Confirm RoHS compliance status and lead times directly with authorized distributors. Ensure ordering specifications match the required operating temperature range and voltage parameters for your application design.

Selection Notes

Select this component when a robust through-hole solution is required for driving high-current LEDs. The 200 mA sink capability suits applications needing significant brightness without external transistors. Consider the PDIP package for prototyping or environments where manual assembly is preferred over automated SMT processes.

Part Context

This part belongs to the TLC5921 series of LED drivers from Texas Instruments. It complements other variants like the TLC5921DAP (HTSSOP) and TLC59210IN, offering similar functional architectures but differing in package type and specific electrical characteristics. The series is designed for versatile LED control applications.

Replacement Considerations

The TLC5921DAP serves as a parameter-equivalent alternative, though it utilizes a 32-HTSSOP surface-mount package instead of the PDIP form factor. Verify pinout compatibility and thermal management requirements when substituting between these package types.