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TLC69699DYYR is listed in the Specialized range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is BRIDGE BETWEEN SPI AND LOCAL DIM. Review the specifications below when checking this part for your BOM.
The TLC69699DYYR is an LED display driver manufactured by Texas Instruments, designed to bridge SPI communication with local dimming control. It operates within a supply voltage range of 2.5 V to 5.5 V and supports surface-mount installation in a SOT-23-THIN-14 package. The device functions reliably across an extended temperature range from -40°C to +85°C. Key integrated features include CRC verification, fault output monitoring, an interrupt pin, an internal oscillator, and under-voltage lockout (UVLO). This component is part of the TLC69699 series and is suitable for applications requiring precise LED management.
Verify the specific ordering suffix DYYR against official Texas Instruments documentation to confirm the exact package type and reel specifications. Ensure compatibility with existing PCB footprints for the SOT-23-THIN-14 form factor. Cross-reference the datasheet for any recent revisions that may impact design-in parameters or recommended operating conditions.
Select this component when a compact solution for SPI-to-local-dimming bridging is required. The SOT-23-THIN-14 package offers space efficiency compared to larger alternatives. Consider the 2.5 V to 5.5 V input range for power supply flexibility. Verify that the -40°C to +85°C operating temperature aligns with the target application environment requirements.
This device belongs to the TLC69699 series of LED display drivers from Texas Instruments. It serves as a specialized interface between standard SPI controllers and local dimming circuits. The series is engineered for applications demanding reliable LED control with built-in diagnostic features such as CRC and fault outputs.
The TLC69699DRRR is a variant within the same series but utilizes a WSON-12 package instead of the SOT-23-THIN-14 found in the DYYR version. Designers must evaluate footprint compatibility and thermal performance differences before substituting.
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