TLE2425MDRG4

Overview

The TLE2425MDRG4 is a precision virtual ground integrated circuit manufactured by Texas Instruments, designed to provide a stable 2.5V reference for single-supply analog systems. It operates within an extended temperature range of -55°C to 125°C and utilizes an 8-pin SOIC (D) surface-mount package. The device delivers a typical output current capability of 20 mA while maintaining micropower operation with a bias current of approximately 170 µA. Key electrical specifications include a temperature coefficient of 20 ppm/°C, input voltage regulation of 1.5 µV/V, and an output impedance of 7.5 mΩ.

Feature Summary

• Integrates a precision micropower voltage reference and high-performance operational amplifier into a single silicon chip
• Provides increased dynamic signal range and improved signal-to-noise ratio in single-supply applications
• Delivers excellent load and input regulation characteristics exceeding 12 bits of accuracy on a 5-V system
• Includes a SPICE macromodel for circuit simulation

Applications

• Signal-conditioning front ends for data acquisition systems requiring 12-bit or higher accuracy
• Single-supply analog systems needing a precise termination for all signal grounds
• Interfaces with ADCs and DACs to eliminate major sources of system error
• Applications requiring lower distortion and improved signal accuracy compared to resistor-capacitor solutions

Procurement Notes

Verify the specific suffix 'MDRG4' corresponds to the military-grade temperature range (-55°C to 125°C) and tape-and-reel packaging format. Confirm that the RoHS compliance status aligns with project requirements, as indicated by the NIPDAU lead finish. Ensure compatibility with the 8-pin SOIC footprint during PCB layout verification.

Selection Notes

Select this component when operating environments require performance stability from -55°C to 125°C. The M-suffix variant is necessary for extreme temperature conditions where C or I suffixes would fail. Consider the 20 mA sink/source capability for driving moderate loads without external buffering. The SOIC package facilitates automated surface-mount assembly processes.

Part Context

This device belongs to the TLE2425 family of precision virtual grounds. While other variants like TLE2425CD or TLE2425ID offer similar electrical performance, they are restricted to commercial (0°C to 70°C) or industrial (-40°C to 85°C) temperature ranges. The TLE2425MDRG4 specifically addresses the need for robust operation in harsh thermal environments using a standard surface-mount form factor.

Replacement Considerations

TLE2425MD is the tube-packaged equivalent of the same die and specification set.