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The TLE2426CLPR is a precision virtual ground generator manufactured by Texas Instruments, designed to split a single power supply rail into positive and negative rails. It operates within an input voltage range of 2 V to 40 V and provides an output voltage adjustable between 2 V and 20 V. The device features an initial accuracy of 1% and a temperature coefficient of 35 PPM/C. It supports a maximum shunt current of 20 mA and functions reliably across a temperature range of -55°C to +125°C. Packaged in a TO-92-3 through-hole format, it serves as a stable reference for analog circuits requiring a mid-supply potential.
Verify the specific suffix CLPR against the latest Texas Instruments datasheet to confirm package type and thermal specifications. Check for Product Change Notifications or End-of-Life notices, as discontinuance alerts may affect long-term availability. Ensure the ordering part number matches the required TO-92-3 through-hole configuration and industrial temperature grade before finalizing procurement.
Select the TLE2426CLPR when a robust through-hole solution is required for virtual ground generation in industrial or automotive environments. Its wide operating temperature range and high accuracy make it suitable for applications where dual supplies are impractical. Consider the TO-92-3 package constraints regarding current handling and thermal dissipation compared to surface-mount alternatives like the CD or ID variants.
The TLE2426 series is a family of 'Rail Splitter' devices widely used in analog design to simplify power distribution. The CLPR variant specifically denotes the commercial grade version housed in a TO-92-3 plastic transistor-style package. This form factor facilitates easy prototyping and integration into legacy through-hole designs while maintaining the core functionality of precision voltage division provided by the broader TLE2426 product line.
Direct functional substitutes include other TLE2426 variants such as TLE2426CD (SOIC-8) or TLE2426CP (PDIP-8), though package differences require PCB layout adjustments. Verify pinout compatibility and thermal performance when substituting with different package types from the same family.