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TLE7263EXUMA2 is listed in the Specialized range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is IC INTERFACE SPECIALIZED BODY. Review the specifications below when checking this part for your BOM.
The TLE7263EXUMA2 is a System Basis Chip (SBC) designed for automotive CAN-LIN gateway applications. It integrates a high-speed CAN transceiver supporting up to 1 MBaud, a LIN transceiver compatible with specifications 1.3 through 2.1 and SAE J2602-2, and dual low-dropout voltage regulators providing 5 V outputs at 150 mA each. The device includes a 150 mA high-side switch, four monitoring/wake-up inputs, and a window watchdog. Communication with the microcontroller is handled via a standard 16-bit SPI interface. It operates within an extended temperature range of -40°C to +150°C and is housed in a PG-DSO-36-53 package.
Verify component authenticity by checking the marking code on the PG-DSO-36-53 package against official Infineon documentation. Confirm the specific suffix matches the requested reel or cut tape configuration. Ensure the supplier provides valid traceability records for automotive-grade components.
Select this component when a combined CAN and LIN interface is required alongside integrated power regulation. The dual 5V LDOs are suitable for powering both the microcontroller and internal CAN modules. Verify that the 150 mA current rating of the high-side switch meets the requirements for any connected peripheral loads.
This part belongs to the TLE7263 family of System Basis Chips from Infineon Technologies. These devices are engineered specifically for robust automotive environments, offering high integration to reduce board space and component count while maintaining strict functional safety standards.
Consult the official Infineon product selection guide for direct pin-compatible alternatives within the TLE726x series. Verify that any substitute maintains identical package dimensions and thermal characteristics.
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