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The TLE8261EXUMA1 is an automotive System Basis Chip (SBC) from the HERMES family, designed for CAN-LIN applications such as body controllers and gateways. It integrates a High-Speed CAN transceiver compliant with ISO 11898-2/5 and SAE J2284, supporting data rates up to 1 MBaud. The device includes three low-dropout voltage regulators: Vcc1µC (200 mA, 5 V), Vcc2 (200 mA, 5 V), and Vcc3 (up to 400 mA). Key features include a 16-bit SPI interface, configurable watchdog timer, Limp Home output, and multiple power modes including Sleep and Stop. It operates within a temperature range of -40°C to +150°C and is housed in a PG-DSO-36-38 package.
Verify the specific ordering suffix 'XUMA1' against the manufacturer's official documentation to confirm tape and reel packaging details. Ensure compatibility with the PG-DSO-36-38 exposed pad thermal requirements during PCB layout. Confirm that the component meets RoHS compliance standards as specified in the datasheet.
Select this component for applications requiring a single-chip solution combining HS-CAN communication and power regulation without LIN integration. Compare with TLE8262E if one LIN channel is needed, or TLE8263E/TLE8264E for additional LIN channels. Ensure the design accommodates the 36-pin DSO package and utilizes the exposed die pad for thermal dissipation.
The TLE8261E belongs to the scalable HERMES SBC family, which offers hardware and software compatibility across variants. Unlike other members like the TLE8262E or TLE8263E, the TLE8261E specifically lacks LIN transceivers, focusing on HS-CAN functionality. This makes it suitable for simpler network topologies where LIN connectivity is not required.
Direct replacements within the HERMES family include TLE8262E (1 LIN), TLE8263E (2 LIN), and TLE8264E (3 LIN), provided the application does not require the additional LIN channels. Ensure pin compatibility and software configuration differences are addressed when migrating.