TLE8262EXUMA3

Overview

The TLE8262EXUMA3 is an automotive-grade specialized transceiver manufactured by Infineon Technologies. It is housed in a 36-BSSOP package with an exposed pad, designed for surface-mount installation. The component operates within the Automotive grade classification, ensuring reliability for vehicle electronics applications. The device functions as a transceiver, facilitating signal transmission and reception in complex automotive network architectures.

Feature Summary

• Automotive-grade qualification for vehicle electronic systems
• Integrated transceiver functionality for data communication
• 36-BSSOP (7.50mm width) package with exposed pad for thermal management

Applications

• Automotive body system networks
• Vehicle communication bus interfaces
• Electronic control unit interconnects

Procurement Notes

Verify the specific datasheet for electrical characteristics and pin configurations before integration. Confirm that the 36-BSSOP footprint matches the PCB layout requirements. Ensure handling procedures account for the exposed pad design to maintain thermal performance and mechanical stability during assembly.

Selection Notes

Select this component when a robust automotive transceiver is required in a compact 36-pin form factor. The exposed pad design suggests suitability for applications needing efficient heat dissipation. Verify compatibility with existing bus protocols and voltage levels specified in the official documentation.

Part Context

This part belongs to Infineon's portfolio of specialized integrated circuits for automotive applications. It complements other body system ICs by providing reliable transceiver capabilities within a standardized surface-mount package suitable for high-volume manufacturing processes.

Replacement Considerations

Check for direct pin-to-pin replacements within the same product family. Ensure any substitute maintains the 36-BSSOP package dimensions and automotive grade certification to preserve system integrity.