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— IC芯片 | 连接器 | 传感器 | 被动器件 —
The TLE8263-2E is a Universal System Basis Chip (SBC) designed for automotive body controller and gateway applications. It integrates a high-speed CAN transceiver compliant with ISO 11898-2, two LIN transceivers conforming to LIN 2.1, and three low-dropout voltage regulators (Vcc1µC, Vcc2, Vcc3). The device features a 16-bit SPI interface for control and monitoring, along with supervision functions including a watchdog timer and undervoltage reset. It supports multiple power modes such as Sleep and Stop to minimize quiescent current while maintaining wake-up capabilities via bus messages or the WK input.
Verify that the ordering suffix XUMA1 corresponds to the Tape & Reel packaging format. Confirm the specific revision level required for the application, as datasheet Rev. 1.0 is referenced. Ensure compatibility with the PG-DSO-36-38 exposed pad package for thermal management.
Select this component when an application requires a single IC solution for both CAN and LIN interfaces alongside power regulation. Consider the TLE8264-2E if three LIN channels are needed instead of two. Verify that the external PNP transistor requirements for Vcc3 align with the system's power distribution design.
This part belongs to the HERMES scalable SBC family from Infineon Technologies. It shares hardware and software compatibility with other members like the TLE8264-2E and TLE8262E, differing primarily in the number of integrated LIN cells. The family is designed for complete coverage of automotive body electronics needs.
The TLE8264-2E serves as a functional alternative within the same family, offering three LIN channels instead of two. Both parts share identical pinouts and software functionality, allowing for potential pin-to-pin substitution if additional LIN connectivity is required.