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The TLE82642EXUMA1 is an automotive-grade transceiver integrated circuit manufactured by Infineon Technologies. It is housed in a 36-BSSOP package with dimensions of 0.295 inches (7.50mm) width and includes an exposed pad for thermal management. The device is designed for surface-mount installation and meets automotive qualification standards. This component functions as a communication interface within vehicle electronic systems, facilitating data transmission across network buses.
Verify the specific revision level and tape-and-reel packaging configuration upon ordering. Confirm that the 36-BSSOP footprint matches the target PCB layout, particularly regarding the exposed pad thermal connection requirements. Ensure compliance with automotive quality standards relevant to the end application.
Select this component when a high-density, automotive-qualified transceiver is required for space-constrained designs. The 36-pin form factor supports complex integration needs compared to smaller packages. Consider the exposed pad for thermal dissipation if operating in high-current or high-temperature conditions typical of automotive ECUs.
This part belongs to the category of specialized ICs used in automotive electronics. It serves as a critical link in vehicle networking architectures, ensuring reliable signal integrity between microcontrollers and bus lines. Its automotive grade designation indicates adherence to strict durability and performance criteria defined by industry standards.
Check pin-to-pin compatibility with existing designs before substitution. Verify that any alternative transceiver maintains the same automotive qualification level and package thermal characteristics to ensure system reliability.