TLE82642EXUMA2

TLE82642EXUMA2

$3.29
  • Description:IC SYSTEM BASIS CHIP DSO-36
  • Package:Bulk

SKU:b81f43a88b8f Category: Brand:

  
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Product Detailed Parameters

  • Description:IC SYSTEM BASIS CHIP DSO-36
  • Package:Bulk
  • Series:*
  • Mfr:Infineon Technologies
  • Type:-
  • Applications:-
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TLE82642EXUMA2

Overview

The TLE8264-2E is a universal System Basis Chip (SBC) designed for automotive CAN-LIN applications, such as body controllers and gateways. It integrates a High-Speed CAN transceiver compliant with ISO 11898-2 and three LIN transceivers conforming to LIN 2.1. The device provides three low-dropout voltage regulators: Vcc1µC (5V, 200mA), Vcc2 (5V, 200mA), and Vcc3 (5V, up to 400mA with external PNP). Supervision features include a configurable timeout or window watchdog, undervoltage reset, and overtemperature protection. Communication is managed via a 16-bit SPI interface, supporting multiple power modes including Sleep, Stop, and Fail-Safe.

Feature Summary

  • Integrated HS-CAN transceiver supporting data rates up to 1 MBaud
  • Three LIN transceivers compatible with LIN 2.1 and ISO 9141 standards
  • Three internal voltage regulators: Vcc1µC, Vcc2, and Vcc3 (with external PNP support)
  • Configurable Timeout or Window Watchdog circuit with reset functionality

Applications

  • Body Control Modules (BCM)
  • Gateway Applications
  • Central Body Computer Systems

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current product selection guide to confirm package type and temperature range availability. Confirm RoHS compliance status and lead times directly with authorized distributors or Infineon Technologies sales representatives prior to procurement.

Selection Notes

Select this component for designs requiring three independent LIN channels alongside a high-speed CAN bus. Ensure the external PNP transistor configuration is utilized if load currents for Vcc3 exceed the internal shunt limit of 200 mA. Verify that the microcontroller supports the required 16-bit SPI protocol for SBC configuration and diagnostic monitoring.

Part Context

This device belongs to the HERMES scalable System Basis Chip family from Infineon Technologies. It shares hardware and software compatibility with other members like the TLE8263-2E and TLE8262E, differentiated primarily by the number of integrated LIN cells and Limp Home outputs.

Replacement Considerations

Compatible replacements within the same family include the TLE8263-2E (2 LIN channels) and TLE8262E (1 LIN channel). These variants offer identical software functionality but differ in the number of LIN transceivers and Limp Home output configurations.

TLE82642EXUMA2TLE82642EXUMA2
$3.29
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