TLE82642EXUMA3

TLE82642EXUMA3

  • Description:IC TRANSCEIVER DSO36-38
  • Package:Tape & Reel (TR)

SKU:737f6308409c Category: Brand:

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Product Detailed Parameters

  • Description:IC TRANSCEIVER DSO36-38
  • Package:Tape & Reel (TR)
  • Series:-
  • Mfr:Infineon Technologies
  • Type:Transceiver
  • Applications:-
  • Mounting Type:Surface Mount
  • Package / Case:36-BSSOP (0.295", 7.50mm Width) Exposed Pad
  • Supplier Device Package:PG-DSO-36-38
  • Grade:Automotive
  • Qualification:-

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TLE82642EXUMA3

Overview

The TLE8264-2E is a universal System Basis Chip (SBC) designed for automotive body controller and gateway applications. It integrates one High-Speed CAN transceiver compliant with ISO 11898-2/5, three LIN transceivers conforming to LIN 2.1, and three low-dropout voltage regulators (Vcc1µC, Vcc2, Vcc3). The device features a 16-bit SPI interface for configuration and monitoring, including a watchdog timer and interrupt management. It supports multiple power modes such as Sleep and Stop to minimize quiescent current while maintaining wake-up capabilities via bus messages or the WK pin.

Feature Summary

  • Integrates one HS-CAN transceiver supporting up to 1 MBaud and three LIN transceivers supporting up to 20 kBaud (115 kBaud in Flash Mode).
  • Provides three independent 5V low-dropout voltage regulators: Vcc1µC (200mA), Vcc2 (200mA), and Vcc3 (up to 400mA with external PNP).
  • Includes three open-drain Limp Home outputs for fail-safe operation and dedicated side indicator/PWM signals.
  • Features a 16-bit SPI interface for control, diagnostic data retrieval, and configuration of watchdog timers and power modes.

Applications

  • Body Control Modules (BCM)
  • Gateway Applications
  • Decentralized Front Light Modules
  • Door Modules with Lock and Mirror Control

Procurement Notes

Verify that the ordering suffix EXUMA3 corresponds to the PG-DSO-36-38 package with Tape & Reel packaging. Confirm RoHS compliance and AEC qualification status through official Infineon documentation before procurement.

Selection Notes

Select this model when three LIN channels are required alongside a single HS-CAN channel. Ensure the application utilizes the exposed die pad for thermal dissipation and connects it to GND for optimal EMC performance. Verify that the external PNP transistor requirements for Vcc3 align with the load specifications.

Part Context

This component belongs to the HERMES scalable SBC family. It shares hardware and software compatibility with variants like the TLE8263-2E, differing primarily in the number of integrated LIN cells and Limp Home outputs. The TLE8264-2E specifically provides three LIN interfaces compared to two in the TLE8263-2E.

Replacement Considerations

TLE8263-2E offers identical functionality but includes only two LIN transceivers instead of three. Other family members like TLE8264E provide only one Limp Home output compared to the three found in the -2E variant.

TLE82642EXUMA3TLE82642EXUMA3

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