TLE8264EXUMA4

TLE8264EXUMA4

  • Description:IC TRANSCEIVER DSO36-38
  • Package:Tape & Reel (TR)

SKU:9728d2b93605 Category: Brand:

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Product Detailed Parameters

  • Description:IC TRANSCEIVER DSO36-38
  • Package:Tape & Reel (TR)
  • Series:-
  • Mfr:Infineon Technologies
  • Type:Transceiver
  • Applications:-
  • Mounting Type:Surface Mount
  • Package / Case:36-BSSOP (0.295", 7.50mm Width) Exposed Pad
  • Supplier Device Package:PG-DSO-36-38
  • Grade:Automotive
  • Qualification:-

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TLE8264EXUMA4

Overview

The TLE8264EXUMA4 is a Universal System Basis Chip (HERMES family) designed for automotive CAN-LIN applications. It integrates a High-Speed CAN transceiver compliant with ISO 11898-2, three LIN transceivers conforming to LIN 2.1 and SAE J2602-2, and three low-dropout voltage regulators (Vcc1µC, Vcc2, Vcc3). The device features a 16-bit SPI interface for configuration and monitoring, a watchdog timer, and Limp Home outputs for fail-safe operation. It operates within an input voltage range of 4.5 V to 45 V and supports temperatures from -40°C to +150°C TJ. The component is housed in a 36-BSSOP package with an exposed pad.

Feature Summary

  • Integrated HS-CAN transceiver supporting up to 1 MBaud and LIN transceivers supporting up to 20 kBaud (115 kBaud in Flash Mode)
  • Three internal voltage regulators: Vcc1µC (5 V/200 mA), Vcc2 (5 V/200 mA), and Vcc3 (configurable up to 400 mA)
  • Fail-safe architecture with configurable Limp Home outputs and multiple operating modes including Sleep, Stop, and Normal
  • Comprehensive supervision including window/time-out watchdog, undervoltage reset, and overtemperature protection

Applications

  • Body Control Modules (BCM)
  • Gateway Applications
  • Decentralized Front Light Modules
  • Door Modules with Lock and Mirror Control
  • HVAC Control Modules

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current documentation to confirm package type and tape/reel specifications. Ensure compatibility with the target application's voltage requirements and thermal management needs, as the device operates in an enhanced power package requiring proper PCB layout for heat dissipation via the exposed die pad.

Selection Notes

Select this component for designs requiring integrated CAN and LIN communication with centralized power management. Compare with other HERMES family members (e.g., TLE8263E, TLE8262E) based on the required number of LIN channels and Limp Home outputs. Ensure the external circuitry supports the specific regulator configurations and wake-up sources defined by the selected SBC configuration.

Part Context

The TLE8264EXUMA4 belongs to the Infineon HERMES scalable System Basis Chip family. It shares identical software functionality and hardware features with siblings like the TLE8263E and TLE8262E, differing primarily in the number of integrated LIN cells and Limp Home outputs. This scalability allows for unified design processes across various automotive body control applications.

Replacement Considerations

Direct replacements within the HERMES family include TLE8263EXUMA4 (2 LIN channels) or TLE8262EXUMA4 (1 LIN channel). Substitution requires verifying that the reduced number of LIN interfaces and Limp Home outputs meets the system requirements.

TLE8264EXUMA4TLE8264EXUMA4

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