TLP109(IGM-TPL,E

$1.10

Description：OPTOISOLTR 3.75KV 1CH TRANS 6-SO
Series：-
Mfr：Toshiba Semiconductor and Storage
Package：Tape & Reel (TR),Cut Tape (CT)

SKU:17a3b28a24f4 Category: Transistor, Photovoltaic Output Optoisolators Brand: Toshiba Semiconductor and Storage

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Product introduction

Product Detailed Parameters

Description：OPTOISOLTR 3.75KV 1CH TRANS 6-SO
Series：-
Mfr：Toshiba Semiconductor and Storage
Package：Tape & Reel (TR),Cut Tape (CT)
Number of Channels：1
Voltage - Isolation：3750Vrms
Current Transfer Ratio (Min)：25% @ 10mA
Current Transfer Ratio (Max)：75% @ 10mA
Turn On / Turn Off Time (Typ)：450ns, 450ns
Rise / Fall Time (Typ)：-
Input Type：DC
Output Type：Transistor
Voltage - Output (Max)：20V
Current - Output / Channel：8mA
Voltage - Forward (Vf) (Typ)：1.64V
Current - DC Forward (If) (Max)：20 mA
Vce Saturation (Max)：-
Operating Temperature：-55°C ~ 125°C
Mounting Type：Surface Mount
Package / Case：6-SOIC (0.179", 4.55mm Width), 5 Leads
Supplier Device Package：6-SO, 5 Lead
Grade：-
Qualification：-

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TLP109(IGM-TPL,E

Overview

The TLP109(IGM-TPL,E is a high-speed optocoupler manufactured by Toshiba Semiconductor and Storage. It features a single channel with a GaAlAs LED input and a phototransistor output housed in a SOIC-6 package. Key electrical parameters include an insulation voltage of 3750 Vrms, a data rate of 1 Mb/s, and a current transfer ratio ranging from 25% to 75%. The device supports a maximum forward current of 16 mA with a typical forward voltage of 1.64 V. Switching characteristics include rise and fall times of 800 ns each. It operates within a temperature range of -55°C to +125°C and dissipates up to 140 mW.

Feature Summary

High common mode transient immunity ensures reliable signal transmission in noisy environments.
Reinforced insulation class compliance with guaranteed creepage and clearance distances for safety standards.
TTL compatibility allows direct interfacing with digital logic circuits without additional level shifting.

Applications

Isolation interface between Intelligent Power Modules (IPM) and control IC circuits
Digital logic isolation in industrial inverters
Motor control application signal isolation

Procurement Notes

Verify the specific suffix configuration against the official Toshiba datasheet to ensure the correct packaging and lead frame material match the design requirements. Confirm that the ordered variant aligns with the required safety certifications such as UL or VDE for the intended end-use equipment. Cross-reference the component marking with the manufacturer's identification codes to prevent counterfeit substitution during procurement.

Selection Notes

Select this component when reinforced insulation and high common mode transient immunity are critical for system safety and noise rejection. The SOIC-6 package size suits space-constrained surface-mount designs requiring robust galvanic isolation. Ensure the application voltage does not exceed the specified limits while considering the thermal dissipation capabilities within the operating temperature range.

Part Context

The TLP109 series belongs to Toshiba's mini-flat coupler family designed for surface-mount assembly. These devices integrate high-output-power LEDs with high-speed photodetector chips to provide fast switching speeds. The series is engineered to meet international safety standards through optimized internal geometry, offering a compact solution for modern electronic isolation needs in industrial and consumer applications.