TLP109(IGM,E)

TLP109(IGM,E)

$1.71
  • Description:OPTOISOLTR 3.75KV 1CH TRANS 6-SO
  • Series:-
  • Mfr:Toshiba Semiconductor and Storage
  • Package:Tube

SKU:e1ebbd76c728 Category: Brand:

  
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Product Detailed Parameters

  • Description:OPTOISOLTR 3.75KV 1CH TRANS 6-SO
  • Series:-
  • Mfr:Toshiba Semiconductor and Storage
  • Package:Tube
  • Number of Channels:1
  • Voltage - Isolation:3750Vrms
  • Current Transfer Ratio (Min):25% @ 10mA
  • Current Transfer Ratio (Max):75% @ 10mA
  • Turn On / Turn Off Time (Typ):450ns, 450ns
  • Rise / Fall Time (Typ):-
  • Input Type:DC
  • Output Type:Transistor
  • Voltage - Output (Max):20V
  • Current - Output / Channel:8mA
  • Voltage - Forward (Vf) (Typ):1.64V
  • Current - DC Forward (If) (Max):20 mA
  • Vce Saturation (Max):-
  • Operating Temperature:-55°C ~ 125°C
  • Mounting Type:Surface Mount
  • Package / Case:6-SOIC (0.179", 4.55mm Width), 5 Leads
  • Supplier Device Package:6-SO, 5 Lead
  • Grade:-
  • Qualification:-

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TLP109(IGM,E)

Overview

The TLP109(IGM,E) is a high-speed optocoupler featuring a GaAlAs infrared LED optically coupled to a photodiode-transistor chip. It provides 3750 Vrms isolation voltage and supports data rates up to 1 Mb/s. The device operates within a temperature range of -55°C to 125°C, with a typical forward voltage of 1.64V and maximum DC forward current of 20 mA. Output characteristics include an 8 mA collector current and 20 V maximum output voltage. Propagation delay and switching times are typically 800 ns.

Feature Summary

  • High-speed operation suitable for digital logic isolation and communication interfaces
  • Meets reinforced insulation class requirements with guaranteed creepage and clearance distances
  • TTL-compatible input configuration for direct interface with standard logic circuits

Applications

  • Isolation interface between Intelligent Power Modules (IPM) and control IC circuits in motor control applications
  • Digital logic isolation for industrial inverters and power supply feedback control
  • Output interface to CMOS, LSTTL, and TTL circuits in telecommunication equipment

Procurement Notes

Verify the specific suffix designation against official Toshiba documentation to confirm exact package variant and environmental compliance status. Ensure that the ordered part number matches the required insulation thickness and safety certification standards for the target application. Cross-reference manufacturer datasheets for precise handling and storage conditions related to moisture sensitivity levels.

Selection Notes

Select this component when high common mode transient immunity and fast switching speeds are required for signal isolation. The integrated photodiode-transistor structure offers superior speed compared to conventional phototransistor couplers. Consider the operating temperature range and isolation voltage ratings to ensure compatibility with high-voltage industrial or motor drive environments.

Part Context

This device belongs to the TLP109 series of mini-flat couplers designed for surface-mount assembly. It utilizes a 6-pin SOIC package to provide compact isolation solutions. The series is engineered to meet international safety standards, including UL 1577 and VDE specifications, ensuring reliable performance in reinforced insulation applications.

Replacement Considerations

Public confirmed substitute part numbers: QXM501.

TLP109(IGM,E)TLP109(IGM,E)
$1.71
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