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The TLP109(TPL,E is a high-speed optocoupler manufactured by Toshiba Semiconductor and Storage. It features a single channel with a transistor output type, housed in a 6-SO, 5-lead surface-mount package. The device provides an isolation voltage of 3750 Vrms and supports a data rate of 1 Mb/s. Key electrical parameters include a maximum forward current of 20 mA, a typical forward voltage of 1.64 V, and an output current of 8 mA. The current transfer ratio is specified at a minimum of 20% when tested at 16 mA. Switching performance includes rise and fall times of 800 ns. The component operates within a temperature range of -55°C to 125°C.
Verify the specific suffix code against official Toshiba documentation to confirm exact packaging and tape specifications. Confirm RoHS compliance status and lead-free characteristics directly from the manufacturer's datasheet before procurement. Ensure the ordering quantity aligns with standard reel sizes if bulk purchasing is required. Cross-reference the part number with authorized distributors to validate authenticity and supply chain integrity.
Select this component when high-speed digital isolation is required alongside robust safety standards. The 3750 Vrms insulation rating suits applications demanding reinforced isolation barriers. The compact SOIC footprint facilitates dense surface-mount assembly. Consider the 800 ns switching speed for signal integrity requirements in motor drive or inverter control environments where fast response times are critical.
This device belongs to the TLP109 series of high-speed optocouplers designed for industrial and automotive applications. It replaces older generations like the TLP112A, offering improved switching speeds and higher isolation voltages. The mini-flat coupler design optimizes board space while maintaining strict safety clearances required by international standards for power electronics interfaces.
The TLP112A is a discontinued model that can be replaced by the TLP109 series. Verify pin compatibility and insulation voltage differences when substituting legacy components. Ensure the replacement meets the specific creepage and clearance requirements of the original design.
The maximum operating temperature is +125°C.
Yes, the device is compatible with TTL logic levels.