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The TLP109(V4,E) is a high-speed optocoupler manufactured by Toshiba Semiconductor and Storage. It features a single channel with a Photo-IC output type, housed in an SOIC-6 package (5 leads). The device provides an insulation voltage of 3750 Vrms and supports data rates up to 1 Mb/s. Key electrical parameters include a current transfer ratio of 20%, a forward current of 16 mA, and a forward voltage of 1.64 V. Switching performance is characterized by rise and fall times of 800 ns each. The unit operates within a temperature range of -55°C to +125°C, with a power dissipation of 140 mW and an output current capacity of 8 mA.
Verify the specific suffix designation against official Toshiba documentation to confirm exact packaging configuration and reel specifications. Ensure that the ordered component matches the required insulation voltage and operating temperature range for the target application environment. Cross-reference the manufacturer part number with authorized distributor catalogs to validate authenticity and traceability before procurement.
Select this component when high-speed digital isolation is required alongside robust safety standards. The device is appropriate for designs needing a compact surface-mount footprint with guaranteed propagation delay consistency. Consider the thermal management requirements given the 140 mW power dissipation limit and the wide operating temperature range for industrial or automotive environments.
This component belongs to the TLP109 series of mini-flat couplers designed for surface-mount assembly. The series utilizes a small-outline package to facilitate automated PCB placement while maintaining high isolation performance. The TLP109 family is engineered to meet international safety standards for reinforced insulation, making it suitable for critical isolation barriers in power electronics and industrial control systems.
Public confirmed substitute part numbers are not available in the provided source material.