TLP120(GB-TPR,F)

Description：OPTOISO 3.75KV 1CH TRANS 6-MFSOP
Series：-
Mfr：Toshiba Semiconductor and Storage
Package：Tape & Reel (TR)

SKU:673e18e356e0 Category: Transistor, Photovoltaic Output Optoisolators Brand: Toshiba Semiconductor and Storage

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Product introduction

Product Detailed Parameters

Description：OPTOISO 3.75KV 1CH TRANS 6-MFSOP
Series：-
Mfr：Toshiba Semiconductor and Storage
Package：Tape & Reel (TR)
Number of Channels：1
Voltage - Isolation：3750Vrms
Current Transfer Ratio (Min)：100% @ 5mA
Current Transfer Ratio (Max)：600% @ 5mA
Turn On / Turn Off Time (Typ)：3µs, 3µs
Rise / Fall Time (Typ)：2µs, 3µs
Input Type：AC, DC
Output Type：Transistor
Voltage - Output (Max)：80V
Current - Output / Channel：50mA
Voltage - Forward (Vf) (Typ)：1.15V
Current - DC Forward (If) (Max)：50 mA
Vce Saturation (Max)：400mV
Operating Temperature：-55°C ~ 100°C
Mounting Type：Surface Mount
Package / Case：6-SMD (4 Leads), Gull Wing
Supplier Device Package：6-MFSOP, 4 Lead

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TLP120(GB-TPR,F)

Overview

The TLP120(GB-TPR,F) is a mini flat coupler featuring a photo transistor optically coupled to two inverse-parallel gallium arsenide infrared emitting diodes. This configuration enables direct AC input current operation without external bridge rectifiers. The device provides high isolation voltage of 3750Vrms and supports collector-emitter voltages up to 80V. It utilizes an MFSOP-6 surface mount package, designed for compact PCB layouts in industrial and communication applications requiring reliable signal isolation.

Feature Summary

Direct AC input capability via dual inverse-parallel GaAs LEDs
High insulation voltage rating for safety isolation
Compact surface mount packaging for automated assembly

Applications

AC/DC input modules for programmable controllers
Telecommunication interface circuits
Solid-state relay driver stages

Procurement Notes

Verify component authenticity through authorized Toshiba distributors. Confirm RoHS compliance status and specific tape-and-reel packaging requirements prior to ordering. Ensure storage conditions meet moisture sensitivity level standards to maintain solderability and electrical performance upon installation.

Selection Notes

Select this component when direct AC sensing is required within isolated control systems. The dual LED structure eliminates the need for external rectification components, reducing bill of materials complexity. Evaluate thermal dissipation capabilities against peak forward current requirements in the target application environment.

Part Context

This part belongs to Toshiba's mini flat coupler series, designed specifically for surface mount technology integration. The TLP120 family offers enhanced isolation characteristics compared to standard DIP packages while maintaining compatibility with existing phototransistor output interfaces used in legacy industrial control designs.