TLP121(GR-TPL,F)

Description：OPTOISO 3.75KV 1CH TRANS 6-MFSOP
Series：-
Mfr：Toshiba Semiconductor and Storage
Package：Tape & Reel (TR)

SKU:f3762002b7d1 Category: Transistor, Photovoltaic Output Optoisolators Brand: Toshiba Semiconductor and Storage

Consult the customer manager about the wholesale price.

consultation hotline：86-132-6715-2157

email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.

Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Product introduction

Product Detailed Parameters

Description：OPTOISO 3.75KV 1CH TRANS 6-MFSOP
Series：-
Mfr：Toshiba Semiconductor and Storage
Package：Tape & Reel (TR)
Number of Channels：1
Voltage - Isolation：3750Vrms
Current Transfer Ratio (Min)：100% @ 5mA
Current Transfer Ratio (Max)：300% @ 5mA
Turn On / Turn Off Time (Typ)：3µs, 3µs
Rise / Fall Time (Typ)：2µs, 3µs
Input Type：DC
Output Type：Transistor
Voltage - Output (Max)：80V
Current - Output / Channel：50mA
Voltage - Forward (Vf) (Typ)：1.15V
Current - DC Forward (If) (Max)：50 mA
Vce Saturation (Max)：400mV
Operating Temperature：-55°C ~ 100°C
Mounting Type：Surface Mount
Package / Case：6-SMD (4 Leads), Gull Wing
Supplier Device Package：6-MFSOP, 4 Lead

Download product information

TLP121(GR-TPL,F)

Overview

The TLP121(GR-TPL,F) is a single-channel transistor output optocoupler manufactured by Toshiba Semiconductor and Storage. It integrates a gallium arsenide infrared emitting diode with a phototransistor in a compact DIP-4 plastic package. The device features a minimum collector-emitter breakdown voltage of 80V and a maximum forward current of 50mA. The GR rank specifies a nominal current transfer ratio of 100%. It provides a minimum isolation voltage of 3750Vrms and operates within a temperature range of -25°C to 85°C.

Feature Summary

Integrates a GaAs infrared LED with a phototransistor for electrical isolation
High current transfer ratio capability in the GR rank configuration
Provides robust insulation between input and output circuits
Designed for surface mount assembly in small outline packages

Applications

Office machines such as copiers and printers
Programmable controllers and industrial automation systems
AC/DC input modules for signal interfacing
Telecommunication equipment requiring signal isolation

Procurement Notes

Verify component authenticity through official Toshiba Semiconductor and Storage channels or authorized distributors. Confirm that the specific suffix (TPL,F) matches the required tape and reel packaging format for automated assembly processes. Ensure compliance with relevant safety certifications such as UL recognition before integration into final products.

Selection Notes

Select this component when high current transfer efficiency is required for low-level signal switching applications. The GR rank offers superior gain compared to standard ranks, making it suitable for driving loads with minimal input current. Consider the DIP-4 package constraints and thermal management requirements for the specified operating temperature range during circuit design.

Part Context

This part belongs to the TLP121 series of mini flat couplers designed for surface mount technology. The series provides compact solutions for isolating control signals from power circuits in space-constrained environments. The specific variant includes lead-free plating options and meets modern environmental standards while maintaining the performance characteristics of the base TLP121 architecture.