TLP137(TPL,F)

Description：OPTOISO 3.75KV TRAN BASE 6MFSOP
Series：-
Mfr：Toshiba Semiconductor and Storage
Package：Tape & Reel (TR)

SKU:d35bb228519a Category: Transistor, Photovoltaic Output Optoisolators Brand: Toshiba Semiconductor and Storage

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Product introduction

Product Detailed Parameters

Description：OPTOISO 3.75KV TRAN BASE 6MFSOP
Series：-
Mfr：Toshiba Semiconductor and Storage
Package：Tape & Reel (TR)
Number of Channels：1
Voltage - Isolation：3750Vrms
Current Transfer Ratio (Min)：100% @ 1mA
Current Transfer Ratio (Max)：1200% @ 1mA
Turn On / Turn Off Time (Typ)：10µs, 8µs
Rise / Fall Time (Typ)：8µs, 8µs
Input Type：DC
Output Type：Transistor with Base
Voltage - Output (Max)：80V
Current - Output / Channel：50mA
Voltage - Forward (Vf) (Typ)：1.15V
Current - DC Forward (If) (Max)：50 mA
Vce Saturation (Max)：400mV
Operating Temperature：-55°C ~ 100°C
Mounting Type：Surface Mount
Package / Case：6-SOIC (0.173", 4.40mm Width), 5 Leads
Supplier Device Package：6-MFSOP, 5 Lead

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TLP137(TPL,F)

Overview

The TLP137(TPL,F) is a high-voltage isolation optocoupler manufactured by Toshiba Semiconductor and Storage. It consists of a gallium arsenide infrared emitting diode and an output transistor, housed in a compact 6-MFSOP package with five leads. The device provides galvanic isolation between input and output circuits, rated at 3750Vrms. Key electrical parameters include a maximum DC forward current (If) of 50 mA, a collector-emitter saturation voltage (Vce Saturation) of 400mV maximum, and a maximum output voltage of 80V. The typical forward voltage (Vf) is 1.15V. It operates within a temperature range of -55°C to 100°C and utilizes surface mount technology for assembly.

Feature Summary

Provides galvanic isolation between input and output circuits using a gallium arsenide infrared LED and output transistor configuration.
Designed for surface mount assembly in a small outline 6-MFSOP package with five leads.
Capable of withstanding high isolation voltages up to 3750Vrms.

Applications

Galvanic isolation in industrial control systems
Signal transmission between microcontrollers and power stages
Noise immunity applications in electronic circuits

Procurement Notes

Verify the exact part number suffix against official Toshiba documentation to ensure correct packaging and tape/reel specifications. Confirm that the 6-MFSOP package variant matches your PCB footprint requirements. Check for any specific handling instructions related to the surface mount technology and thermal management during soldering processes.

Selection Notes

Select this component when high voltage isolation is required in a compact surface mount form factor. Ensure the 50mA forward current limit and 80V output voltage rating meet the circuit design constraints. Consider the operating temperature range of -55°C to 100°C for environmental compatibility. Verify that the 3750Vrms isolation rating satisfies safety standards for the intended application.

Part Context

The TLP137 series belongs to Toshiba's mini flat coupler family, designed for efficient surface mount assembly. These optocouplers integrate an infrared emitting diode with a phototransistor to provide reliable signal transfer across isolated barriers. The TPL designation indicates a specific package and reel configuration within the broader TLP137 product line.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided source material. Consult Toshiba's official cross-reference guides or distributor databases for verified alternatives if direct replacement is necessary.